Microfabrication of ultra-long reinforced silicon neural electrodes. Hajj-Hassan, M., Chodavarapu, V., & Musallam, S. Micro & Nano Letters, 4(1):53-58, IEEE, 2009.
![Microfabrication of ultra-long reinforced silicon neural electrodes [pdf]](https://bibbase.org/img/filetypes/pdf.svg "pdf")
Paper doi abstract bibtex 3 downloads
Paper doi abstract bibtex 3 downloads The authors describe a simple dry-etch silicon microfabrication process to develop an array of electrodes with multiple recording sites suitable for neural recording applications. This new high-yield fabrication process uses commercially available ultra-thin silicon wafers as substrate material. A xenon difluoride system is used to etch the silicon substrate to form the electrode structures. The novel concept of structural reinforcement to produce elongated and reliable probe electrodes is introduced. The authors demonstrate recording silicon electrodes that can reach lengths longer than 10 mm having only 50 mm thicknesses and an 100 mm average width. This new microfabrication process illustrates a simple, cost-effective and mass-producible method for developing ultralong silicon probes for deep brain implantation and neural recording.
@article {hajj-hassan:53,
title = {Microfabrication of ultra-long reinforced silicon neural electrodes},
journal = {Micro \& Nano Letters},
volume = {4},
number = {1},
year = {2009},
pages = {53-58},
publisher = {IEEE},
keywords = {deep brain implantation, dry-etch silicon microfabrication, high-yield fabrication process, neural electrode arrays, neural recording, Si, silicon substrate material, size 100 mum, size 50 mum, structural reinforcement, ultra-long reinforced silicon electrodes, ultra-long silicon probes, xenon difluoride system},
doi = {10.1049/mnl:20090007},
url = {http://npl.mcgill.ca/Papers/Hajj-Hassan2009.pdf},
author = {Hajj-Hassan, M. and Chodavarapu, V. and Musallam, Sam},
abstract={The authors describe a simple dry-etch silicon microfabrication process to develop an array of electrodes with multiple recording sites suitable for neural recording applications. This new high-yield fabrication process uses commercially available ultra-thin silicon wafers as substrate material. A xenon difluoride system is used to etch the silicon substrate to form the electrode structures. The novel concept of structural reinforcement to produce elongated and reliable probe electrodes is introduced. The authors demonstrate recording silicon electrodes that can reach lengths longer than 10 mm having only 50 mm thicknesses and an 100 mm average width. This new microfabrication process illustrates a simple, cost-effective and mass-producible method for developing ultralong silicon probes for deep brain implantation and neural recording.},
}Downloads: 3
{"_id":{"_str":"53422007ecd21cdc07000601"},"__v":148,"authorIDs":["3APtrXiH9D6Sugg5S","5456e6c28b01c8193000003d","545778f42abc8e9f37000424","5de6ee04eab4b7de010000b8","5df85284a0ca62df01000155","5dfbfd85b371afde01000035","5e038868d6cccbdf010000a9","5e03f786ee776fdf01000092","5e044647705486df01000072","5e044c4c705486df010000a8","5e0d4034ae5827df01000034","5e16c634dc7739de0100018b","5e1f735de8f5ddde01000218","5e282ccce6485dde0100005e","5e2fdca34e91a9df01000040","5e3248d5e45eb5df01000098","5e38fec9dc5b8ade01000075","5e3cce3e5cd237de01000015","5e449674ec14b3de0100013e","5e47c30a6c5c7ede010000c5","5e4c85cf5cc521f20100002b","5e4f26b3aa67a8de0100001d","5e5519660096f9de0100004d","5e5aaa3c6ec9eadf010000fc","5e65ab90d92058de01000012","5uANKngwQNgDBJk48","63rnshvzHwPkccxCf","67Qb7nkpgYzGmWAw6","7XMCNhjvTzuQqoZDu","DfNkEqhogCcLbR5RZ","J72QG3kPqnsB5TNzn","KZXG3SLgMFcG2YjRt","N3CLXkjiZrQL56j2a","N4Zn2xfmMtrdXCWqi","NjdfgtcJmCo8qxJAu","QyiqKQyXiaQD8k8Zw","RZc9oSG6uEs9KJzBq","S3snNRagphP9JnhgM","Sh2NJyfRbYhDGzm5L","X8T8fzH4bgF6Paikt","X8mHogWqn7f4r9Fn3","YB8dtNxzhSvqQdPQN","aAB2maSnND2hLoWsS","aNsvE4ywwuxv3qKYG","dnHFuQZPga8cmyBgQ","imSFWwhPTSKo9C7qC","jBerWPDjJqaKYgAbF","nL6XK8skXzQuJx74W","qFxLc4SHtkrxviF4m","qNnPZGcibfD4WfsvM","qpkyYRmkY9AAZQ7jp","sWf3nFEZ3ueLQQEou","sgkCP3aEkHRYDEgic","tCaQuQGCLsWwe5Yaw","uE9esaoKnfDqXKvnq","uKcmsym9Db5Rg5k7x","urAPRxM9nDukL2izo"],"author_short":["Hajj-Hassan, M.","Chodavarapu, V.","Musallam, S."],"bibbaseid":"hajjhassan-chodavarapu-musallam-microfabricationofultralongreinforcedsiliconneuralelectrodes-2009","bibdata":{"bibtype":"article","type":"article","title":"Microfabrication of ultra-long reinforced silicon neural electrodes","journal":"Micro & Nano Letters","volume":"4","number":"1","year":"2009","pages":"53-58","publisher":"IEEE","keywords":"deep brain implantation, dry-etch silicon microfabrication, high-yield fabrication process, neural electrode arrays, neural recording, Si, silicon substrate material, size 100 mum, size 50 mum, structural reinforcement, ultra-long reinforced silicon electrodes, ultra-long silicon probes, xenon difluoride system","doi":"10.1049/mnl:20090007","url":"http://npl.mcgill.ca/Papers/Hajj-Hassan2009.pdf","author":[{"propositions":[],"lastnames":["Hajj-Hassan"],"firstnames":["M."],"suffixes":[]},{"propositions":[],"lastnames":["Chodavarapu"],"firstnames":["V."],"suffixes":[]},{"propositions":[],"lastnames":["Musallam"],"firstnames":["Sam"],"suffixes":[]}],"abstract":"The authors describe a simple dry-etch silicon microfabrication process to develop an array of electrodes with multiple recording sites suitable for neural recording applications. This new high-yield fabrication process uses commercially available ultra-thin silicon wafers as substrate material. A xenon difluoride system is used to etch the silicon substrate to form the electrode structures. The novel concept of structural reinforcement to produce elongated and reliable probe electrodes is introduced. The authors demonstrate recording silicon electrodes that can reach lengths longer than 10 mm having only 50 mm thicknesses and an 100 mm average width. This new microfabrication process illustrates a simple, cost-effective and mass-producible method for developing ultralong silicon probes for deep brain implantation and neural recording.","bibtex":"@article {hajj-hassan:53,\r\ntitle = {Microfabrication of ultra-long reinforced silicon neural electrodes},\r\njournal = {Micro \\& Nano Letters},\r\nvolume = {4},\r\nnumber = {1},\r\nyear = {2009},\r\npages = {53-58},\r\npublisher = {IEEE},\r\nkeywords = {deep brain implantation, dry-etch silicon microfabrication, high-yield fabrication process, neural electrode arrays, neural recording, Si, silicon substrate material, size 100 mum, size 50 mum, structural reinforcement, ultra-long reinforced silicon electrodes, ultra-long silicon probes, xenon difluoride system},\r\ndoi = {10.1049/mnl:20090007},\r\nurl = {http://npl.mcgill.ca/Papers/Hajj-Hassan2009.pdf},\r\nauthor = {Hajj-Hassan, M. and Chodavarapu, V. and Musallam, Sam},\r\nabstract={The authors describe a simple dry-etch silicon microfabrication process to develop an array of electrodes with multiple recording sites suitable for neural recording applications. This new high-yield fabrication process uses commercially available ultra-thin silicon wafers as substrate material. A xenon difluoride system is used to etch the silicon substrate to form the electrode structures. The novel concept of structural reinforcement to produce elongated and reliable probe electrodes is introduced. The authors demonstrate recording silicon electrodes that can reach lengths longer than 10 mm having only 50 mm thicknesses and an 100 mm average width. This new microfabrication process illustrates a simple, cost-effective and mass-producible method for developing ultralong silicon probes for deep brain implantation and neural recording.},\r\n}\r\n\r\n","author_short":["Hajj-Hassan, M.","Chodavarapu, V.","Musallam, S."],"key":"hajj-hassan:53","id":"hajj-hassan:53","bibbaseid":"hajjhassan-chodavarapu-musallam-microfabricationofultralongreinforcedsiliconneuralelectrodes-2009","role":"author","urls":{"Paper":"http://npl.mcgill.ca/Papers/Hajj-Hassan2009.pdf"},"keyword":["deep brain implantation","dry-etch silicon microfabrication","high-yield fabrication process","neural electrode arrays","neural recording","Si","silicon substrate material","size 100 mum","size 50 mum","structural reinforcement","ultra-long reinforced silicon electrodes","ultra-long silicon probes","xenon difluoride system"],"downloads":3,"html":""},"bibtype":"article","biburl":"http://npl.mcgill.ca/npl_pub.bib","downloads":3,"keywords":["deep brain implantation","dry-etch silicon microfabrication","high-yield fabrication process","neural electrode arrays","neural recording","si","silicon substrate material","size 100 mum","size 50 mum","structural reinforcement","ultra-long reinforced silicon electrodes","ultra-long silicon probes","xenon difluoride system"],"search_terms":["microfabrication","ultra","long","reinforced","silicon","neural","electrodes","hajj-hassan","chodavarapu","musallam"],"title":"Microfabrication of ultra-long reinforced silicon neural electrodes","year":2009,"dataSources":["2uX35iRShYyWRpd2E"]}