@inproceedings{spie2023minimizefracture,
  title={Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns},
  author={?Jaime Bravo, Philippe Morey-Chaisemartin, Lifu Chang, Eric Beisser, Frederic Brault, Joshua Zusman},
  booktitle={Proceedings of SPIE},
  number={1249511},
  doi={https://doi.org/10.1117/12.2657011},
  year={2023}
}

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