45nm CMOS - Silicon Photonics Monolithic Technology (45CLO) for next-generation, low power and high speed optical interconnects. Rakowski, M., Meagher, C., Nummy, K., Aboketaf, A., Ayala, J., Bian, Y., Harris, B., Mclean, K., McStay, K., Sahin, A., Medina, L., Peng, B., Sowinski, Z., Stricker, A., Houghton, T., Hedges, C., Giewont, K., Jacob, A., Letavic, T., Riggs, D., Yu, A., & Pellerin, J. In Optical Fiber Communication Conference (OFC) 2020, 2020. Optical Society of America.
45nm CMOS - Silicon Photonics Monolithic Technology (45CLO) for next-generation, low power and high speed optical interconnects [link]Paper  doi  abstract   bibtex   
GLOBALFOUNDRIES' monolithic 45nm CMOS-Silicon Photonics 300mm high-volume manufacturing platform based on 45nm RF technology node, and optimized for high performance and low power short-reach optical interconnects for on-chip and chip-to-chip applications will be discussed.
@inproceedings{Rakowski:20,
author = {Michal Rakowski and Colleen Meagher and Karen Nummy and Abdelsalam Aboketaf and Javier Ayala and Yusheng Bian and Brendan Harris and Kate Mclean and Kevin McStay and Asli Sahin and Louis Medina and Bo Peng and Zoey Sowinski and Andy Stricker and Thomas Houghton and Crystal Hedges and Ken Giewont and Ajey Jacob and Ted Letavic and Dave Riggs and Anthony Yu and John Pellerin},
booktitle = {Optical Fiber Communication Conference (OFC) 2020},
keywords = {Optical devices; Optical interconnects; Optical transceivers; Photonic devices; Silicon modulators; Silicon photonics},
publisher = {Optical Society of America},
title = {45nm CMOS - Silicon Photonics Monolithic Technology (45CLO) for next-generation, low power and high speed optical interconnects},
year = {2020},
url = {http://www.osapublishing.org/abstract.cfm?URI=OFC-2020-T3H.3},
doi = {10.1364/OFC.2020.T3H.3},
abstract = {GLOBALFOUNDRIES' monolithic 45nm CMOS-Silicon Photonics 300mm high-volume manufacturing platform based on 45nm RF technology node, and optimized for high performance and low power short-reach optical interconnects for on-chip and chip-to-chip applications will be discussed.},
}

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