The influence of texture on the elastic properties of ultrafine-grain copper. Agnew, S. R. & Weertman, J. R. Materials Science and Engineering: A, 242(1–2):174–180, February, 1998.
The influence of texture on the elastic properties of ultrafine-grain copper [link]Paper  doi  abstract   bibtex   
The connection between texture and elastic behavior of ultrafine-grain (250 nm) copper produced by severe plastic deformation is investigated. A previous study indicated that as-processed ultrafine-grain copper has a low elastic modulus (E=115 GPa) which recovers the accepted value (128 GPa) after annealing above 150–200°C. It was proposed that the low modulus was the result of non-equilibrium grain boundaries. In the current study we have found that the anomalous elastic behavior is likely to be the result of a deformation texture formed during processing. The texture was characterized by x-ray pole figure analysis, revealing preferred orientations of 10× random. The orientation distribution function was calculated and incorporated into a Hill approximation of the elastic behavior. Experimental ultrasonic velocities were measured revealing anisotropy consistent with the predictions of the Hill approximation. After annealing above the recrystallization temperature (185°C), texture analysis and acoustic velocity measurements showed isotropy was recovered.
@article{agnew_influence_1998,
	title = {The influence of texture on the elastic properties of ultrafine-grain copper},
	volume = {242},
	issn = {0921-5093},
	url = {http://www.sciencedirect.com/science/article/pii/S0921509397005042},
	doi = {10.1016/S0921-5093(97)00504-2},
	abstract = {The connection between texture and elastic behavior of ultrafine-grain (250 nm) copper produced by severe plastic deformation is investigated. A previous study indicated that as-processed ultrafine-grain copper has a low elastic modulus (E=115 GPa) which recovers the accepted value (128 GPa) after annealing above 150–200°C. It was proposed that the low modulus was the result of non-equilibrium grain boundaries. In the current study we have found that the anomalous elastic behavior is likely to be the result of a deformation texture formed during processing. The texture was characterized by x-ray pole figure analysis, revealing preferred orientations of 10× random. The orientation distribution function was calculated and incorporated into a Hill approximation of the elastic behavior. Experimental ultrasonic velocities were measured revealing anisotropy consistent with the predictions of the Hill approximation. After annealing above the recrystallization temperature (185°C), texture analysis and acoustic velocity measurements showed isotropy was recovered.},
	number = {1–2},
	urldate = {2016-02-26},
	journal = {Materials Science and Engineering: A},
	author = {Agnew, S. R. and Weertman, J. R.},
	month = feb,
	year = {1998},
	keywords = {Plastic deformation, texture, Ultrafine grain copper},
	pages = {174--180},
	file = {ScienceDirect Full Text PDF:C\:\\Users\\rwk6aw\\AppData\\Roaming\\Zotero\\Zotero\\Profiles\\bavaocl1.default\\zotero\\storage\\97JB2X48\\Agnew and Weertman - 1998 - The influence of texture on the elastic properties.pdf:application/pdf;ScienceDirect Snapshot:C\:\\Users\\rwk6aw\\AppData\\Roaming\\Zotero\\Zotero\\Profiles\\bavaocl1.default\\zotero\\storage\\SC2228CD\\S0921509397005042.html:text/html}
}

Downloads: 0