@article{journals/mr/BraunBKBAR06,
  added-at = {2020-02-22T00:00:00.000+0100},
  author = {Braun, Tanja and Becker, K.-F. and Koch, M. and Bader, V. and Aschenbrenner, Rolf and Reichl, Herbert},
  biburl = {https://www.bibsonomy.org/bibtex/2d41e87cad6a89388974b164bdf86c899/dblp},
  ee = {https://doi.org/10.1016/j.microrel.2005.06.004},
  interhash = {5c8a016f86286d26d02988d90e72d343},
  intrahash = {d41e87cad6a89388974b164bdf86c899},
  journal = {Microelectron. Reliab.},
  keywords = {dblp},
  number = 1,
  pages = {144-154},
  timestamp = {2020-02-25T13:26:06.000+0100},
  title = {High-temperature reliability of Flip Chip assemblies.},
  url = {http://dblp.uni-trier.de/db/journals/mr/mr46.html#BraunBKBAR06},
  volume = 46,
  year = 2006
}

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