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\n  \n 2022\n \n \n (15)\n \n \n
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\n \n\n \n \n \n \n \n Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions.\n \n \n \n\n\n \n Al Athamneh, R.; Abueed, M.; Bani Hani, D.; Hamasha, S.; and Others\n\n\n \n\n\n\n Crystals, 12(6): 775. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions},\n type = {article},\n year = {2022},\n pages = {775},\n volume = {12},\n publisher = {Multidisciplinary Digital Publishing Institute},\n id = {1abbe60d-fec3-314d-a1b1-1371c7b8cfd0},\n created = {2022-08-26T04:36:09.522Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-08-26T04:36:09.522Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Al Athamneh, Raed and Abueed, Mohammed and Bani Hani, Dania and Hamasha, Sa' and Others, undefined},\n journal = {Crystals},\n number = {6}\n}
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\n \n\n \n \n \n \n \n Effect of Thermal Aging on the Mechanical Properties of SAC305.\n \n \n \n\n\n \n Hamasha, K.; Hamasha, M., M.; and Hamasha, S.\n\n\n \n\n\n\n Materials, 15(8): 2816. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {Effect of Thermal Aging on the Mechanical Properties of SAC305},\n type = {article},\n year = {2022},\n pages = {2816},\n volume = {15},\n publisher = {MDPI},\n id = {2e3d0b4b-af37-3bb0-b594-7669957aa7ad},\n created = {2022-08-26T04:36:28.210Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-08-26T04:36:28.210Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Khozima and Hamasha, Mohammad M and Hamasha, Sa'd},\n journal = {Materials},\n number = {8}\n}
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\n \n\n \n \n \n \n \n Ultra-fine transformation of data for normality.\n \n \n \n\n\n \n Hamasha, M., M.; Ali, H.; Ahmed, A.; and Others\n\n\n \n\n\n\n Heliyon, 8(5): e09370. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {Ultra-fine transformation of data for normality},\n type = {article},\n year = {2022},\n pages = {e09370},\n volume = {8},\n publisher = {Elsevier},\n id = {9b88117f-ad23-3942-8dd6-434066c31eb6},\n created = {2022-08-26T04:36:29.692Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-08-26T04:36:29.692Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Mohammad M and Ali, Haneen and Ahmed, Abdulaziz and Others, undefined},\n journal = {Heliyon},\n number = {5}\n}
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\n \n\n \n \n \n \n \n A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization.\n \n \n \n\n\n \n Al Athamneh, R.; Akkara, F.; and Hamasha, S.\n\n\n \n\n\n\n Journal of Microelectronics and Electronic Packaging, 19(1): 39-47. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization},\n type = {article},\n year = {2022},\n pages = {39-47},\n volume = {19},\n publisher = {International Microelectronics Assembly and Packaging Society Collection},\n id = {c9b21d9a-f021-30e9-b8f8-5b8e40268f98},\n created = {2022-09-11T20:11:24.892Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:24.892Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Al Athamneh, Raed and Akkara, Francy and Hamasha, Sa'd},\n journal = {Journal of Microelectronics and Electronic Packaging},\n number = {1}\n}
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\n \n\n \n \n \n \n \n Investigating Frontline Nurse Stress: Perceptions of Job Demands, Organizational Support, and Social Support During the Current COVID-19 Pandemic.\n \n \n \n\n\n \n Ali, H.; Fatemi, Y.; Ali, D.; Hamasha, M.; and Hamasha, S.\n\n\n \n\n\n\n Frontiers in public health,1457. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
\n
@article{\n title = {Investigating Frontline Nurse Stress: Perceptions of Job Demands, Organizational Support, and Social Support During the Current COVID-19 Pandemic},\n type = {article},\n year = {2022},\n pages = {1457},\n publisher = {Frontiers},\n id = {7b9c35f1-33fb-3c2f-bc91-acf53c2e2541},\n created = {2022-09-11T20:11:25.139Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:25.139Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Ali, Haneen and Fatemi, Yasin and Ali, Duha and Hamasha, Mohammad and Hamasha, Sa'},\n journal = {Frontiers in public health}\n}
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\n \n\n \n \n \n \n \n An approximation to the inverse of left-sided truncated gaussian cumulative normal density function using Polya's model to generate random variates for simulation applications.\n \n \n \n\n\n \n Hamasha, M., M.; Ahmed, A.; Ali, H.; Hamasha, S.; and Aqlan, F.\n\n\n \n\n\n\n Journal of Applied Engineering Science, 20(2): 582-589. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
\n
@article{\n title = {An approximation to the inverse of left-sided truncated gaussian cumulative normal density function using Polya's model to generate random variates for simulation applications},\n type = {article},\n year = {2022},\n pages = {582-589},\n volume = {20},\n id = {c9c41545-525e-3171-87fe-314a350a3d0b},\n created = {2022-09-11T20:11:25.389Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:25.389Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Mohammad M and Ahmed, Abdulaziz and Ali, Haneen and Hamasha, Sa' and Aqlan, Faisal},\n journal = {Journal of Applied Engineering Science},\n number = {2}\n}
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\n \n\n \n \n \n \n \n Markovian analysis of unreliable multi-machine flexible manufacturing cell.\n \n \n \n\n\n \n Hamasha, M.; Hamasha, S.; Aqlan, F.; and Almeanazel, O.\n\n\n \n\n\n\n PloS one, 17(2): e0259247. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
\n
@article{\n title = {Markovian analysis of unreliable multi-machine flexible manufacturing cell},\n type = {article},\n year = {2022},\n pages = {e0259247},\n volume = {17},\n publisher = {Public Library of Science San Francisco, CA USA},\n id = {abff8cd4-1c8f-3f89-821a-e95571b11ab2},\n created = {2022-09-11T20:11:25.669Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:25.669Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Mohammad and Hamasha, Sa’d and Aqlan, Faisal and Almeanazel, Osama},\n journal = {PloS one},\n number = {2}\n}
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\n \n\n \n \n \n \n \n Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints.\n \n \n \n\n\n \n Hani, D., B.; Al Athamneh, R.; and others\n\n\n \n\n\n\n IEEE Transactions on Device and Materials Reliability. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
\n
@article{\n title = {Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints},\n type = {article},\n year = {2022},\n publisher = {IEEE},\n id = {c1d90158-c747-3096-8a72-f3e31a994190},\n created = {2022-09-11T20:11:25.941Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:25.941Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hani, Dania Bani and Al Athamneh, Raed and others, undefined},\n journal = {IEEE Transactions on Device and Materials Reliability}\n}
\n
\n\n\n\n
\n\n\n
\n \n\n \n \n \n \n \n Effect of Thermal Aging on the Mechanical Properties of SAC305.\n \n \n \n\n\n \n Hamasha, K.; Hamasha, M., M.; and Hamasha, S.\n\n\n \n\n\n\n Materials, 15(8): 2816. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {Effect of Thermal Aging on the Mechanical Properties of SAC305},\n type = {article},\n year = {2022},\n pages = {2816},\n volume = {15},\n publisher = {MDPI},\n id = {84efd289-120c-3fa3-a2ff-cf548742da54},\n created = {2022-09-11T20:11:26.214Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:26.214Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Khozima and Hamasha, Mohammad M and Hamasha, Sa’d},\n journal = {Materials},\n number = {8}\n}
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\n \n\n \n \n \n \n \n Ultra-fine transformation of data for normality.\n \n \n \n\n\n \n Hamasha, M., M.; Ali, H.; Ahmed, A.; and others\n\n\n \n\n\n\n Heliyon, 8(5): e09370. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
\n
@article{\n title = {Ultra-fine transformation of data for normality},\n type = {article},\n year = {2022},\n pages = {e09370},\n volume = {8},\n publisher = {Elsevier},\n id = {414b7e0f-e9ae-346d-9e1e-633efaf1e23c},\n created = {2022-09-11T20:11:26.489Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:26.489Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Mohammad M and Ali, Haneen and Ahmed, Abdulaziz and others, undefined},\n journal = {Heliyon},\n number = {5}\n}
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\n \n\n \n \n \n \n \n Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis.\n \n \n \n\n\n \n Wei, X.; Belhadi, M.; Hamasha, S.; Alahmer, A.; Zhao, R.; Prorok, B.; and Sakib, N.\n\n\n \n\n\n\n Journal of Electronic Packaging. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis},\n type = {article},\n year = {2022},\n id = {394df03d-8e12-3453-86ee-661f0ec7c939},\n created = {2022-09-11T20:11:26.751Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:26.751Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Wei, Xin and Belhadi, Mohamed and Hamasha, Sa' and Alahmer, Ali and Zhao, Rong and Prorok, Bart and Sakib, Nazmus},\n journal = {Journal of Electronic Packaging}\n}
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\n \n\n \n \n \n \n \n Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions.\n \n \n \n\n\n \n Al Athamneh, R.; Abueed, M.; Bani Hani, D.; Hamasha, S.; and others\n\n\n \n\n\n\n Crystals, 12(6): 775. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
\n
@article{\n title = {Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions},\n type = {article},\n year = {2022},\n pages = {775},\n volume = {12},\n publisher = {Multidisciplinary Digital Publishing Institute},\n id = {417b7e14-bd9a-3059-bc5e-0be439fa8861},\n created = {2022-09-11T20:11:27.018Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:27.018Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Al Athamneh, Raed and Abueed, Mohammed and Bani Hani, Dania and Hamasha, Sa’ and others, undefined},\n journal = {Crystals},\n number = {6}\n}
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\n \n\n \n \n \n \n \n Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions.\n \n \n \n\n\n \n Al Athamneh, R.; Abueed, M.; Bani Hani, D.; Hamasha, S.; and Others\n\n\n \n\n\n\n Crystals, 12(6): 775. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions},\n type = {article},\n year = {2022},\n pages = {775},\n volume = {12},\n publisher = {Multidisciplinary Digital Publishing Institute},\n id = {2197e3dd-51de-3d6a-8589-e08eb3393b7b},\n created = {2022-09-11T20:11:28.172Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:28.172Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Al Athamneh, Raed and Abueed, Mohammed and Bani Hani, Dania and Hamasha, Sa' and Others, undefined},\n journal = {Crystals},\n number = {6}\n}
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\n \n\n \n \n \n \n \n Effect of Thermal Aging on the Mechanical Properties of SAC305.\n \n \n \n\n\n \n Hamasha, K.; Hamasha, M., M.; and Hamasha, S.\n\n\n \n\n\n\n Materials, 15(8): 2816. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {Effect of Thermal Aging on the Mechanical Properties of SAC305},\n type = {article},\n year = {2022},\n pages = {2816},\n volume = {15},\n publisher = {MDPI},\n id = {e1f93832-f7cf-3b7d-b3db-b3650df5934e},\n created = {2022-09-11T20:11:28.436Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:28.436Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Khozima and Hamasha, Mohammad M and Hamasha, Sa'd},\n journal = {Materials},\n number = {8}\n}
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\n \n\n \n \n \n \n \n Ultra-fine transformation of data for normality.\n \n \n \n\n\n \n Hamasha, M., M.; Ali, H.; Ahmed, A.; and Others\n\n\n \n\n\n\n Heliyon, 8(5): e09370. 2022.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {Ultra-fine transformation of data for normality},\n type = {article},\n year = {2022},\n pages = {e09370},\n volume = {8},\n publisher = {Elsevier},\n id = {b3fe3d31-1a8a-359e-8fa2-9e4982b65f83},\n created = {2022-09-11T20:11:28.713Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:28.713Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Mohammad M and Ali, Haneen and Ahmed, Abdulaziz and Others, undefined},\n journal = {Heliyon},\n number = {5}\n}
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\n  \n 2021\n \n \n (4)\n \n \n
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\n \n\n \n \n \n \n \n A MATHEMATICAL APPROXIMATION TO LEFT-SIDED TRUNCATED NORMAL DISTRIBUTION BASED ON HART'S MODEL.\n \n \n \n\n\n \n Hamasha, M.; Ali, H.; Ahmed, A.; and Others\n\n\n \n\n\n\n Journal of Applied Engineering Science, 19(4): 1049-1055. 2021.\n \n\n\n\n
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@article{\n title = {A MATHEMATICAL APPROXIMATION TO LEFT-SIDED TRUNCATED NORMAL DISTRIBUTION BASED ON HART'S MODEL},\n type = {article},\n year = {2021},\n pages = {1049-1055},\n volume = {19},\n id = {99e0226c-fc27-34f8-ac83-efb9587fddfd},\n created = {2022-08-26T04:36:26.667Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-08-26T04:36:26.667Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Mohammad and Ali, Haneen and Ahmed, Abdulaziz and Others, undefined},\n journal = {Journal of Applied Engineering Science},\n number = {4}\n}
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\n \n\n \n \n \n \n \n A MATHEMATICAL APPROXIMATION TO LEFT-SIDED TRUNCATED NORMAL DISTRIBUTION BASED ON HART’S MODEL.\n \n \n \n\n\n \n Hamasha, M.; Ali, H.; Ahmed, A.; and others\n\n\n \n\n\n\n Journal of Applied Engineering Science, 19(4): 1049-1055. 2021.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {A MATHEMATICAL APPROXIMATION TO LEFT-SIDED TRUNCATED NORMAL DISTRIBUTION BASED ON HART’S MODEL},\n type = {article},\n year = {2021},\n pages = {1049-1055},\n volume = {19},\n id = {253e42f1-0ce5-3908-9077-95dfe8f27afa},\n created = {2022-09-11T20:11:24.352Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:24.352Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Mohammad and Ali, Haneen and Ahmed, Abdulaziz and others, undefined},\n journal = {Journal of Applied Engineering Science},\n number = {4}\n}
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\n \n\n \n \n \n \n \n Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures.\n \n \n \n\n\n \n Hasan, S., M., K.; Fahim, A.; Al Ahsan, M.; Suhling, J., C.; Hamasha, S.; and Lall, P.\n\n\n \n\n\n\n In International Electronic Packaging Technical Conference and Exhibition, volume 85505, pages V001T07A016, 2021. \n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@inproceedings{\n title = {Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures},\n type = {inproceedings},\n year = {2021},\n pages = {V001T07A016},\n volume = {85505},\n id = {8005fbc5-fb7c-30a2-a755-ca541114bbff},\n created = {2022-09-11T20:11:24.610Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:24.610Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {inproceedings},\n private_publication = {false},\n bibtype = {inproceedings},\n author = {Hasan, S M Kamrul and Fahim, Abdullah and Al Ahsan, Mohammad and Suhling, Jeffrey C and Hamasha, Sa'd and Lall, Pradeep},\n booktitle = {International Electronic Packaging Technical Conference and Exhibition}\n}
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\n \n\n \n \n \n \n \n A MATHEMATICAL APPROXIMATION TO LEFT-SIDED TRUNCATED NORMAL DISTRIBUTION BASED ON HART'S MODEL.\n \n \n \n\n\n \n Hamasha, M.; Ali, H.; Ahmed, A.; and Others\n\n\n \n\n\n\n Journal of Applied Engineering Science, 19(4): 1049-1055. 2021.\n \n\n\n\n
\n\n\n\n \n\n \n\n \n link\n  \n \n\n bibtex\n \n\n \n\n \n\n \n \n \n \n \n \n \n\n  \n \n \n\n\n\n
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@article{\n title = {A MATHEMATICAL APPROXIMATION TO LEFT-SIDED TRUNCATED NORMAL DISTRIBUTION BASED ON HART'S MODEL},\n type = {article},\n year = {2021},\n pages = {1049-1055},\n volume = {19},\n id = {f1a28641-2373-335c-bc7d-5cb422ca41b8},\n created = {2022-09-11T20:11:27.908Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:27.908Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Hamasha, Mohammad and Ali, Haneen and Ahmed, Abdulaziz and Others, undefined},\n journal = {Journal of Applied Engineering Science},\n number = {4}\n}
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\n  \n 2020\n \n \n (2)\n \n \n
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\n \n\n \n \n \n \n \n Effect of Varying Amplitude Cycling on SAC-Bi Solder Joint Fatigue.\n \n \n \n\n\n \n Jian, M.; Wei, X.; Suhling, J.; Lall, P.; and Others\n\n\n \n\n\n\n In 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pages 1017-1023, 2020. \n \n\n\n\n
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@inproceedings{\n title = {Effect of Varying Amplitude Cycling on SAC-Bi Solder Joint Fatigue},\n type = {inproceedings},\n year = {2020},\n pages = {1017-1023},\n id = {e4006adf-f314-3790-8a4d-00b261479984},\n created = {2022-08-26T04:36:24.808Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-08-26T04:36:24.808Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {inproceedings},\n private_publication = {false},\n bibtype = {inproceedings},\n author = {Jian, Minghong and Wei, Xin and Suhling, Jeff and Lall, Pradeep and Others, undefined},\n booktitle = {2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)}\n}
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\n \n\n \n \n \n \n \n Effect of Varying Amplitude Cycling on SAC-Bi Solder Joint Fatigue.\n \n \n \n\n\n \n Jian, M.; Wei, X.; Suhling, J.; Lall, P.; and Others\n\n\n \n\n\n\n In 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pages 1017-1023, 2020. \n \n\n\n\n
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@inproceedings{\n title = {Effect of Varying Amplitude Cycling on SAC-Bi Solder Joint Fatigue},\n type = {inproceedings},\n year = {2020},\n pages = {1017-1023},\n id = {6e67730b-d45d-3b66-b441-f86b4b49e16c},\n created = {2022-09-11T20:11:27.571Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:27.571Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {inproceedings},\n private_publication = {false},\n bibtype = {inproceedings},\n author = {Jian, Minghong and Wei, Xin and Suhling, Jeff and Lall, Pradeep and Others, undefined},\n booktitle = {2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)}\n}
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\n \n\n \n \n \n \n \n Reliability Modeling of Microelectronic Interconnections in Long-term Applications.\n \n \n \n\n\n \n Al Athamneh, R.\n\n\n \n\n\n\n . 2019.\n \n\n\n\n
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@article{\n title = {Reliability Modeling of Microelectronic Interconnections in Long-term Applications},\n type = {article},\n year = {2019},\n id = {e600ecec-1d0e-36d2-9435-1653d8dc76d0},\n created = {2022-08-26T04:36:30.946Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-08-26T04:36:30.946Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Al Athamneh, Raed}\n}
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\n \n\n \n \n \n \n \n Reliability Modeling of Microelectronic Interconnections in Long-term Applications.\n \n \n \n\n\n \n Al Athamneh, R.\n\n\n \n\n\n\n . 2019.\n \n\n\n\n
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@article{\n title = {Reliability Modeling of Microelectronic Interconnections in Long-term Applications},\n type = {article},\n year = {2019},\n id = {98c6cac7-5411-396a-9993-9f55177b093b},\n created = {2022-09-11T20:11:28.985Z},\n file_attached = {false},\n profile_id = {e9c72371-09b8-307d-b126-d79b2f77abef},\n group_id = {625b259d-2a88-39f6-8a10-34a38ed030f7},\n last_modified = {2022-09-11T20:11:28.985Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n source_type = {article},\n private_publication = {false},\n bibtype = {article},\n author = {Al Athamneh, Raed}\n}
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