@inproceedings{10.1117/12.2657011,
author = {Jaime Bravo and Philippe Morey-Chaisemartin and Lifu Chang and Eric Beisser and Frederic Brault and Joshua Zusman},
title = {{Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patterns}},
volume = {12495},
booktitle = {DTCO and Computational Patterning II},
editor = {Ryoung-Han Kim and Neal V. Lafferty},
organization = {International Society for Optics and Photonics},
publisher = {SPIE},
pages = {1249511},
keywords = {Advanced Packaging, 3D ICs, 3D Integration, Frame Generation, Thin Wafer, Fracture, Stress, Patterning},
year = {2023},
doi = {10.1117/12.2657011},
URL = {https://doi.org/10.1117/12.2657011}
}

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