Temperature-gradient based test scheduling for 3D stacked ICs. Aghaee, N., Peng, Z., & Eles, P. In ICECS, pages 405-408, 2013. IEEE.
Temperature-gradient based test scheduling for 3D stacked ICs. [link]Link  Temperature-gradient based test scheduling for 3D stacked ICs. [link]Paper  bibtex   
@inproceedings{ conf/icecsys/AghaeePE13,
  added-at = {2015-03-10T00:00:00.000+0100},
  author = {Aghaee, Nima and Peng, Zebo and Eles, Petru},
  biburl = {http://www.bibsonomy.org/bibtex/257ae7ad77266002d5e55ced5d10dc924/dblp},
  booktitle = {ICECS},
  crossref = {conf/icecsys/2013},
  ee = {http://dx.doi.org/10.1109/ICECS.2013.6815440},
  interhash = {f1c8402a382c07bd5c680fb9f3b91cae},
  intrahash = {57ae7ad77266002d5e55ced5d10dc924},
  keywords = {dblp},
  pages = {405-408},
  publisher = {IEEE},
  title = {Temperature-gradient based test scheduling for 3D stacked ICs.},
  url = {http://dblp.uni-trier.de/db/conf/icecsys/icecsys2013.html#AghaeePE13},
  year = {2013}
}

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