@article{
 title = {Development of Thin-Film Liquid-Crystal-Polymer Surface-Mount Packages for $Ka$ -Band Applications},
 type = {article},
 year = {2008},
 identifiers = {[object Object]},
 keywords = {hermetic seals;liquid crystal polymers;microwave c},
 pages = {2111-2117},
 volume = {56},
 id = {5f3471d5-370d-3a03-ab3b-598e160f8af7},
 created = {2020-04-13T20:08:31.327Z},
 file_attached = {false},
 profile_id = {ac5c8e47-7448-34f1-9dda-fe44957f5950},
 group_id = {ebb0c10c-30f1-31a4-b724-9e94c775c126},
 last_modified = {2020-04-13T20:08:31.327Z},
 read = {false},
 starred = {false},
 authored = {false},
 confirmed = {true},
 hidden = {false},
 citation_key = {4599242},
 source_type = {article},
 private_publication = {false},
 abstract = {In this paper, we present the design and development of thin-film liquid-crystal-polymer (LCP) surface-mount packages for Ka-band applications. The packages are constructed using multilayer LCP films and are surface mounted on a printed circuit board (PCB). Our experimental results demonstrate that the package feed-through transition including a PCB launch and bond wires achieve a return loss of better than -20 dB and an insertion loss of less than 0.4 dB around Ka-band. We achieve a measured port-to-port isolation of the package to be more than 45 dB across the Ka-band. We demonstrate the package feed-through circuit model by comparing the simulation of model and bare die measurement data to a packaged amplifier measurement. Finally, we report an LCP cavity that has a measured fine leak rate of 3.6 times 10-8 atmldrcc/s.},
 bibtype = {article},
 author = {Aihara, K and Chen, M J and Pham, A},
 journal = {IEEE Transactions on Microwave Theory and Techniques},
 number = {9}
}

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