@inProceedings{
 title = {A compact model for mm-wave transmission lines and interconnects on lossy CMOS substrates},
 type = {inProceedings},
 year = {2010},
 identifiers = {[object Object]},
 id = {1c2c97cb-e207-3f70-8c45-9a080825011a},
 created = {2017-12-04T05:35:00.334Z},
 file_attached = {false},
 profile_id = {99d7e05e-a704-3549-ada2-dfc74a2d55ec},
 last_modified = {2017-12-04T05:35:00.334Z},
 read = {false},
 starred = {false},
 authored = {true},
 confirmed = {false},
 hidden = {false},
 private_publication = {false},
 abstract = {A methodology for generating a scalable compact model for on-chip transmission lines and interconnects on lossy silicon substrate is presented. The model is demonstrated over 20-60 GHz frequency band using two types of transmission lines built in TSMC's 0.18 μm CMOS technology. Several Coplanar Waveguides (CPW) and Microstrip lines are designed with different lengths to verify the accuracy and scalability of the extracted model. The compact model shows an excellent agreement with measured data with maximum deviation in S  11  magnitude and phase of 9.2% and 5.6%, respectively, and maximum deviation in S 21  magnitude and phase of 10.1% and 6.6%, respectively. Compared to existing model extraction methodologies, the required time for generating the compact model and simulating transmission lines is reduced significantly. The generated models are fully compatible with all commercial circuit simulators. ©2010 IEEE.},
 bibtype = {inProceedings},
 author = {Akour, A. and Khalil, W. and Volakis, J. and Ismail, M.},
 booktitle = {2010 IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2010 - Proceedings}
}

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