Pad de-embedding in RF CMOS. Aktas, A. & Ismail, M. IEEE Circuits and Devices Magazine, 2001. abstract bibtex Techniques for radio frequency (RF) pad layout and de-embedding were discussed. These are important for implementing RF circuits in CMOS technology. Two kinds of probe pad patterns were presented. One is highly lossy due to low CMOS substrate resistivity and the other pad pattern uses ground shield underneath the signal pad. Two approaches for de-embedding were also discussed. In one method claibration patterns for standards were placed on the same test die with pads, and use these standards for network analyzer calibration. In other method, primary pad parasitics were in parallel with the pad structure and off-wafer standards on an impedance standard substrate (ISS) was used.
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title = {Pad de-embedding in RF CMOS},
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year = {2001},
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abstract = {Techniques for radio frequency (RF) pad layout and de-embedding were discussed. These are important for implementing RF circuits in CMOS technology. Two kinds of probe pad patterns were presented. One is highly lossy due to low CMOS substrate resistivity and the other pad pattern uses ground shield underneath the signal pad. Two approaches for de-embedding were also discussed. In one method claibration patterns for standards were placed on the same test die with pads, and use these standards for network analyzer calibration. In other method, primary pad parasitics were in parallel with the pad structure and off-wafer standards on an impedance standard substrate (ISS) was used.},
bibtype = {article},
author = {Aktas, A. and Ismail, M.},
journal = {IEEE Circuits and Devices Magazine},
number = {3}
}
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