@techreport{
 title = {DECOMPOSITION REACTIONS AND TOUGHENING IN NiAI-Cu ALLOYS},
 type = {techreport},
 id = {189d9363-e1ef-3075-baf6-602b521b2475},
 created = {2018-09-14T20:49:55.182Z},
 file_attached = {true},
 profile_id = {70644822-a92d-388e-a930-3d28afc76b1e},
 group_id = {f7d35d58-7823-3e09-9e83-2d24928a3f0e},
 last_modified = {2019-01-07T22:04:21.955Z},
 read = {false},
 starred = {false},
 authored = {false},
 confirmed = {true},
 hidden = {false},
 private_publication = {false},
 abstract = {In the NiAl-Cu 3 Al pseudobinary section of the Ni-Al-Cu ternary system, the structural similarity of the binary phases yields a miscibility gap between NiAl (B2 structure with ao=-0.2880 nm) and Cu 3 Al (bcc structure above 5670 C with ao= 0 .2946 nm). Due to the extensive mutual solubility, alloys can be solution-treated as single-phase NiAI and then aged at temperatures within the miscibility gap to investigate possible decomposition reactions. Several NiAl-Cu alloys (containing up to 30 at% Cu) were solution-treated at 1000° C, water-quenched, and then aged at either 475" C or 525* C. The decomposition of the supersaturated NiAl was characterized using XRD and SEM. A modulated microstructure was observed for an initial aging of 24 hours, and is consistent with the presence of a conditional spinodal between the NiAl and the Cu 3},
 bibtype = {techreport},
 author = {Allen, W P and Foley, J C and Cooper, R F and Perepezko, J H}
}

{"_id":"zXyEDzjk5civ5rmTi","bibbaseid":"allen-foley-cooper-perepezko-decompositionreactionsandtougheninginniaicualloys","downloads":0,"creationDate":"2019-01-26T04:23:27.284Z","title":"DECOMPOSITION REACTIONS AND TOUGHENING IN NiAI-Cu ALLOYS","author_short":["Allen, W., P.","Foley, J., C.","Cooper, R., F.","Perepezko, J., H."],"year":null,"bibtype":"techreport","biburl":null,"bibdata":{"title":"DECOMPOSITION REACTIONS AND TOUGHENING IN NiAI-Cu ALLOYS","type":"techreport","id":"189d9363-e1ef-3075-baf6-602b521b2475","created":"2018-09-14T20:49:55.182Z","file_attached":"true","profile_id":"70644822-a92d-388e-a930-3d28afc76b1e","group_id":"f7d35d58-7823-3e09-9e83-2d24928a3f0e","last_modified":"2019-01-07T22:04:21.955Z","read":false,"starred":false,"authored":false,"confirmed":"true","hidden":false,"private_publication":false,"abstract":"In the NiAl-Cu 3 Al pseudobinary section of the Ni-Al-Cu ternary system, the structural similarity of the binary phases yields a miscibility gap between NiAl (B2 structure with ao=-0.2880 nm) and Cu 3 Al (bcc structure above 5670 C with ao= 0 .2946 nm). Due to the extensive mutual solubility, alloys can be solution-treated as single-phase NiAI and then aged at temperatures within the miscibility gap to investigate possible decomposition reactions. Several NiAl-Cu alloys (containing up to 30 at% Cu) were solution-treated at 1000° C, water-quenched, and then aged at either 475\" C or 525* C. The decomposition of the supersaturated NiAl was characterized using XRD and SEM. A modulated microstructure was observed for an initial aging of 24 hours, and is consistent with the presence of a conditional spinodal between the NiAl and the Cu 3","bibtype":"techreport","author":"Allen, W P and Foley, J C and Cooper, R F and Perepezko, J H","bibtex":"@techreport{\n title = {DECOMPOSITION REACTIONS AND TOUGHENING IN NiAI-Cu ALLOYS},\n type = {techreport},\n id = {189d9363-e1ef-3075-baf6-602b521b2475},\n created = {2018-09-14T20:49:55.182Z},\n file_attached = {true},\n profile_id = {70644822-a92d-388e-a930-3d28afc76b1e},\n group_id = {f7d35d58-7823-3e09-9e83-2d24928a3f0e},\n last_modified = {2019-01-07T22:04:21.955Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {true},\n hidden = {false},\n private_publication = {false},\n abstract = {In the NiAl-Cu 3 Al pseudobinary section of the Ni-Al-Cu ternary system, the structural similarity of the binary phases yields a miscibility gap between NiAl (B2 structure with ao=-0.2880 nm) and Cu 3 Al (bcc structure above 5670 C with ao= 0 .2946 nm). Due to the extensive mutual solubility, alloys can be solution-treated as single-phase NiAI and then aged at temperatures within the miscibility gap to investigate possible decomposition reactions. Several NiAl-Cu alloys (containing up to 30 at% Cu) were solution-treated at 1000° C, water-quenched, and then aged at either 475\" C or 525* C. The decomposition of the supersaturated NiAl was characterized using XRD and SEM. A modulated microstructure was observed for an initial aging of 24 hours, and is consistent with the presence of a conditional spinodal between the NiAl and the Cu 3},\n bibtype = {techreport},\n author = {Allen, W P and Foley, J C and Cooper, R F and Perepezko, J H}\n}","author_short":["Allen, W., P.","Foley, J., C.","Cooper, R., F.","Perepezko, J., H."],"urls":{"Paper":"https://bibbase.org/service/mendeley/70644822-a92d-388e-a930-3d28afc76b1e/file/2436e8f8-0cbc-93e7-271d-8297a3a4cc53/DECOMPOSITION_REACTIONS_AND_TOUGHENING_IN_NiAI-Cu_ALLOYS.pdf.pdf"},"bibbaseid":"allen-foley-cooper-perepezko-decompositionreactionsandtougheninginniaicualloys","role":"author","downloads":0},"search_terms":["decomposition","reactions","toughening","niai","alloys","allen","foley","cooper","perepezko"],"keywords":[],"authorIDs":[]}