On the Road to the Development of Noninvasive Highly Sensitive Electromagnetic Bio-Sensor for Bone Crack Detection. Anand, R., Dutta, D., & Sarkar, A. In 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, pages 1–4, 2023. IEEE.
Paper doi bibtex @inproceedings{DBLP:conf/ieeesensors/AnandDS23,
author = {Ravi Anand and
Debarati Dutta and
Anirban Sarkar},
title = {On the Road to the Development of Noninvasive Highly Sensitive Electromagnetic
Bio-Sensor for Bone Crack Detection},
booktitle = {2023 {IEEE} SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023},
pages = {1--4},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/SENSORS56945.2023.10324914},
doi = {10.1109/SENSORS56945.2023.10324914},
timestamp = {Fri, 12 Apr 2024 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/ieeesensors/AnandDS23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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