On the Road to the Development of Noninvasive Highly Sensitive Electromagnetic Bio-Sensor for Bone Crack Detection. Anand, R., Dutta, D., & Sarkar, A. In 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, pages 1–4, 2023. IEEE.
On the Road to the Development of Noninvasive Highly Sensitive Electromagnetic Bio-Sensor for Bone Crack Detection [link]Paper  doi  bibtex   
@inproceedings{DBLP:conf/ieeesensors/AnandDS23,
  author       = {Ravi Anand and
                  Debarati Dutta and
                  Anirban Sarkar},
  title        = {On the Road to the Development of Noninvasive Highly Sensitive Electromagnetic
                  Bio-Sensor for Bone Crack Detection},
  booktitle    = {2023 {IEEE} SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/SENSORS56945.2023.10324914},
  doi          = {10.1109/SENSORS56945.2023.10324914},
  timestamp    = {Fri, 12 Apr 2024 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/ieeesensors/AnandDS23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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