A Complete Resistive-Open Defect Analysis for Thermally Assisted Switching MRAMs. Azevedo, J., Virazel, A., Bosio, A., Dilillo, L., Girard, P., Todri-Sanial, A., Alvarez-Herault, J., & Mackay, K. IEEE Trans. VLSI Syst. (TVLSI), 22(11):2326-2335, 2014.
Paper bibtex @article{ dblp1700917,
title = {A Complete Resistive-Open Defect Analysis for Thermally Assisted Switching MRAMs},
author = {Joao Azevedo and Arnaud Virazel and Alberto Bosio and Luigi Dilillo and Patrick Girard and Aida Todri-Sanial and Jérémy Alvarez-Herault and Ken Mackay},
author_short = {Azevedo, J. and Virazel, A. and Bosio, A. and Dilillo, L. and Girard, P. and Todri-Sanial, A. and Alvarez-Herault, J. and Mackay, K.},
bibtype = {article},
type = {article},
year = {2014},
key = {dblp1700917},
id = {dblp1700917},
biburl = {http://www.dblp.org/rec/bibtex/journals/tvlsi/AzevedoVBDGTAM14},
url = {http://dx.doi.org/10.1109/TVLSI.2013.2294080},
journal = {IEEE Trans. VLSI Syst. (TVLSI)},
pages = {2326-2335},
number = {11},
volume = {22},
text = {IEEE Trans. VLSI Syst. (TVLSI) 22(11):2326-2335 (2014)}
}
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