Computer Engineering: Feeling the Heat. Ball, P. 492(7428):174–176.
Computer Engineering: Feeling the Heat [link]Paper  doi  abstract   bibtex   
The more that microcircuits are shrunk, the hotter they get. Engineers are on the hunt for ways to cool off computing.
@article{ballComputerEngineeringFeeling2012,
  title = {Computer Engineering: {{Feeling}} the Heat},
  author = {Ball, Philip},
  date = {2012-12},
  journaltitle = {Nature},
  volume = {492},
  pages = {174--176},
  issn = {0028-0836},
  doi = {10.1038/492174a},
  url = {https://doi.org/10.1038/492174a},
  abstract = {The more that microcircuits are shrunk, the hotter they get. Engineers are on the hunt for ways to cool off computing.},
  keywords = {*imported-from-citeulike-INRMM,~INRMM-MiD:c-11842549,computational-science,electronics,energy,energy-consumption,heating},
  number = {7428}
}
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