Electromechanical Impedance Modeling for Adhesively Bonded Piezo-Transducers. Bhalla, S. & Soh, C. K. Journal of Intelligent Material Systems and Structures, 15(12):955–972, December, 2004. ![Electromechanical Impedance Modeling for Adhesively Bonded Piezo-Transducers [link]](https://bibbase.org/img/filetypes/link.svg "link")
Paper doi bibtex @article{bhalla_electromechanical_2004,
title = {Electromechanical {Impedance} {Modeling} for {Adhesively} {Bonded} {Piezo}-{Transducers}},
volume = {15},
issn = {1045-389X, 1530-8138},
url = {http://journals.sagepub.com/doi/10.1177/1045389X04046309},
doi = {10.1177/1045389X04046309},
language = {en},
number = {12},
urldate = {2019-08-15},
journal = {Journal of Intelligent Material Systems and Structures},
author = {Bhalla, Suresh and Soh, Chee Kiong},
month = dec,
year = {2004},
pages = {955--972},
}
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