@INPROCEEDINGS{9252280,
  author={Y. {Bian} and K. {Ramachandran} and B. {Peng} and B. {Hedrick} and K. {Donegan} and J. {Lubguban} and B. {Fasano} and A. {Rundquist} and J. {Pape} and A. {Sahin} and T. {Houghton} and K. {Nummy} and J. {Steffes} and L. {Medina} and S. G. {Roy} and H. {Cox} and B. {Green} and K. {Dezfulian} and W. S. {Lee} and A. {Stricker} and K. {Mclean} and S. {Hu} and Z. {Sowinski} and C. {Meagher} and A. {Aboketaf} and M. {Rakowski} and M. {Randall} and I. {Melville} and D. {Riggs} and A. {Jacob} and R. {Augur} and D. {Berger} and A. {Yu} and K. {Giewont} and J. {Pellerin}},
  booktitle={2020 IEEE Photonics Conference (IPC)}, 
  title={3D Integrated Laser Attach Technology on 300-mm Monolithic Silicon Photonics Platform}, 
  year={2020},
  pages={1-2},
  abstract={A hybrid laser attach technology was demonstrated on GLOBALFOUNDRIES 300-mm monolithic silicon photonics (SiPh) platform. High accuracy bonding of laser inside a cavity in the SiPh die was accomplished. Optical power up to 10dBm was demonstrated through direct butt-coupling of the laser to SiPh die.},
  keywords={elemental semiconductors;integrated optics;integrated optoelectronics;microassembling;semiconductor lasers;silicon;GLOBALFOUNDRIES monolithic silicon photonics platform;high accuracy bonding;SiPh die;3D integrated laser attach technology;optical power;direct butt-coupling;hybrid laser attach technology;Si;Integrated optics;Integrated circuits;Three-dimensional displays;Semiconductor lasers;Power lasers;Silicon;Photonics;Semiconductor lasers;monolithic silicon photonics;hybrid integration;photonic integrated circuits},
  doi={10.1109/IPC47351.2020.9252280},
  ISSN={2575-274X},
  month={September}
}

{"_id":"9vHNG6HEarpEYqMA5","bibbaseid":"bian-ramachandran-peng-hedrick-donegan-lubguban-fasano-rundquist-etal-3dintegratedlaserattachtechnologyon300mmmonolithicsiliconphotonicsplatform-2020","author_short":["Bian, Y.","Ramachandran, K.","Peng, B.","Hedrick, B.","Donegan, K.","Lubguban, J.","Fasano, B.","Rundquist, A.","Pape, J.","Sahin, A.","Houghton, T.","Nummy, K.","Steffes, J.","Medina, L.","Roy, S. G.","Cox, H.","Green, B.","Dezfulian, K.","Lee, W. S.","Stricker, A.","Mclean, K.","Hu, S.","Sowinski, Z.","Meagher, C.","Aboketaf, A.","Rakowski, M.","Randall, M.","Melville, I.","Riggs, D.","Jacob, A.","Augur, R.","Berger, D.","Yu, A.","Giewont, K.","Pellerin, J."],"bibdata":{"bibtype":"inproceedings","type":"inproceedings","author":[{"firstnames":["Y."],"propositions":[],"lastnames":["Bian"],"suffixes":[]},{"firstnames":["K."],"propositions":[],"lastnames":["Ramachandran"],"suffixes":[]},{"firstnames":["B."],"propositions":[],"lastnames":["Peng"],"suffixes":[]},{"firstnames":["B."],"propositions":[],"lastnames":["Hedrick"],"suffixes":[]},{"firstnames":["K."],"propositions":[],"lastnames":["Donegan"],"suffixes":[]},{"firstnames":["J."],"propositions":[],"lastnames":["Lubguban"],"suffixes":[]},{"firstnames":["B."],"propositions":[],"lastnames":["Fasano"],"suffixes":[]},{"firstnames":["A."],"propositions":[],"lastnames":["Rundquist"],"suffixes":[]},{"firstnames":["J."],"propositions":[],"lastnames":["Pape"],"suffixes":[]},{"firstnames":["A."],"propositions":[],"lastnames":["Sahin"],"suffixes":[]},{"firstnames":["T."],"propositions":[],"lastnames":["Houghton"],"suffixes":[]},{"firstnames":["K."],"propositions":[],"lastnames":["Nummy"],"suffixes":[]},{"firstnames":["J."],"propositions":[],"lastnames":["Steffes"],"suffixes":[]},{"firstnames":["L."],"propositions":[],"lastnames":["Medina"],"suffixes":[]},{"firstnames":["S.","G."],"propositions":[],"lastnames":["Roy"],"suffixes":[]},{"firstnames":["H."],"propositions":[],"lastnames":["Cox"],"suffixes":[]},{"firstnames":["B."],"propositions":[],"lastnames":["Green"],"suffixes":[]},{"firstnames":["K."],"propositions":[],"lastnames":["Dezfulian"],"suffixes":[]},{"firstnames":["W.","S."],"propositions":[],"lastnames":["Lee"],"suffixes":[]},{"firstnames":["A."],"propositions":[],"lastnames":["Stricker"],"suffixes":[]},{"firstnames":["K."],"propositions":[],"lastnames":["Mclean"],"suffixes":[]},{"firstnames":["S."],"propositions":[],"lastnames":["Hu"],"suffixes":[]},{"firstnames":["Z."],"propositions":[],"lastnames":["Sowinski"],"suffixes":[]},{"firstnames":["C."],"propositions":[],"lastnames":["Meagher"],"suffixes":[]},{"firstnames":["A."],"propositions":[],"lastnames":["Aboketaf"],"suffixes":[]},{"firstnames":["M."],"propositions":[],"lastnames":["Rakowski"],"suffixes":[]},{"firstnames":["M."],"propositions":[],"lastnames":["Randall"],"suffixes":[]},{"firstnames":["I."],"propositions":[],"lastnames":["Melville"],"suffixes":[]},{"firstnames":["D."],"propositions":[],"lastnames":["Riggs"],"suffixes":[]},{"firstnames":["A."],"propositions":[],"lastnames":["Jacob"],"suffixes":[]},{"firstnames":["R."],"propositions":[],"lastnames":["Augur"],"suffixes":[]},{"firstnames":["D."],"propositions":[],"lastnames":["Berger"],"suffixes":[]},{"firstnames":["A."],"propositions":[],"lastnames":["Yu"],"suffixes":[]},{"firstnames":["K."],"propositions":[],"lastnames":["Giewont"],"suffixes":[]},{"firstnames":["J."],"propositions":[],"lastnames":["Pellerin"],"suffixes":[]}],"booktitle":"2020 IEEE Photonics Conference (IPC)","title":"3D Integrated Laser Attach Technology on 300-mm Monolithic Silicon Photonics Platform","year":"2020","pages":"1-2","abstract":"A hybrid laser attach technology was demonstrated on GLOBALFOUNDRIES 300-mm monolithic silicon photonics (SiPh) platform. High accuracy bonding of laser inside a cavity in the SiPh die was accomplished. Optical power up to 10dBm was demonstrated through direct butt-coupling of the laser to SiPh die.","keywords":"elemental semiconductors;integrated optics;integrated optoelectronics;microassembling;semiconductor lasers;silicon;GLOBALFOUNDRIES monolithic silicon photonics platform;high accuracy bonding;SiPh die;3D integrated laser attach technology;optical power;direct butt-coupling;hybrid laser attach technology;Si;Integrated optics;Integrated circuits;Three-dimensional displays;Semiconductor lasers;Power lasers;Silicon;Photonics;Semiconductor lasers;monolithic silicon photonics;hybrid integration;photonic integrated circuits","doi":"10.1109/IPC47351.2020.9252280","issn":"2575-274X","month":"September","bibtex":"@INPROCEEDINGS{9252280,\r\n author={Y. {Bian} and K. {Ramachandran} and B. {Peng} and B. {Hedrick} and K. {Donegan} and J. {Lubguban} and B. {Fasano} and A. {Rundquist} and J. {Pape} and A. {Sahin} and T. {Houghton} and K. {Nummy} and J. {Steffes} and L. {Medina} and S. G. {Roy} and H. {Cox} and B. {Green} and K. {Dezfulian} and W. S. {Lee} and A. {Stricker} and K. {Mclean} and S. {Hu} and Z. {Sowinski} and C. {Meagher} and A. {Aboketaf} and M. {Rakowski} and M. {Randall} and I. {Melville} and D. {Riggs} and A. {Jacob} and R. {Augur} and D. {Berger} and A. {Yu} and K. {Giewont} and J. {Pellerin}},\r\n booktitle={2020 IEEE Photonics Conference (IPC)}, \r\n title={3D Integrated Laser Attach Technology on 300-mm Monolithic Silicon Photonics Platform}, \r\n year={2020},\r\n pages={1-2},\r\n abstract={A hybrid laser attach technology was demonstrated on GLOBALFOUNDRIES 300-mm monolithic silicon photonics (SiPh) platform. High accuracy bonding of laser inside a cavity in the SiPh die was accomplished. Optical power up to 10dBm was demonstrated through direct butt-coupling of the laser to SiPh die.},\r\n keywords={elemental semiconductors;integrated optics;integrated optoelectronics;microassembling;semiconductor lasers;silicon;GLOBALFOUNDRIES monolithic silicon photonics platform;high accuracy bonding;SiPh die;3D integrated laser attach technology;optical power;direct butt-coupling;hybrid laser attach technology;Si;Integrated optics;Integrated circuits;Three-dimensional displays;Semiconductor lasers;Power lasers;Silicon;Photonics;Semiconductor lasers;monolithic silicon photonics;hybrid integration;photonic integrated circuits},\r\n doi={10.1109/IPC47351.2020.9252280},\r\n ISSN={2575-274X},\r\n month={September}\r\n} \r\n\r\n\r\n\r\n","author_short":["Bian, Y.","Ramachandran, K.","Peng, B.","Hedrick, B.","Donegan, K.","Lubguban, J.","Fasano, B.","Rundquist, A.","Pape, J.","Sahin, A.","Houghton, T.","Nummy, K.","Steffes, J.","Medina, L.","Roy, S. G.","Cox, H.","Green, B.","Dezfulian, K.","Lee, W. S.","Stricker, A.","Mclean, K.","Hu, S.","Sowinski, Z.","Meagher, C.","Aboketaf, A.","Rakowski, M.","Randall, M.","Melville, I.","Riggs, D.","Jacob, A.","Augur, R.","Berger, D.","Yu, A.","Giewont, K.","Pellerin, J."],"bibbaseid":"bian-ramachandran-peng-hedrick-donegan-lubguban-fasano-rundquist-etal-3dintegratedlaserattachtechnologyon300mmmonolithicsiliconphotonicsplatform-2020","role":"author","urls":{},"keyword":["elemental semiconductors;integrated optics;integrated optoelectronics;microassembling;semiconductor lasers;silicon;GLOBALFOUNDRIES monolithic silicon photonics platform;high accuracy bonding;SiPh die;3D integrated laser attach technology;optical power;direct butt-coupling;hybrid laser attach technology;Si;Integrated optics;Integrated circuits;Three-dimensional displays;Semiconductor lasers;Power lasers;Silicon;Photonics;Semiconductor lasers;monolithic silicon photonics;hybrid integration;photonic integrated circuits"],"metadata":{"authorlinks":{}}},"bibtype":"inproceedings","biburl":"https://bibbase.org/f/6NMaaRPNDKskwdzK4/ajey-2023.bib","dataSources":["RXa5EamaS2Dk4sSAM","PzLP3Cuwd3wPAZpw6","yCKGz5KC8LnXA68E7"],"keywords":["elemental semiconductors;integrated optics;integrated optoelectronics;microassembling;semiconductor lasers;silicon;globalfoundries monolithic silicon photonics platform;high accuracy bonding;siph die;3d integrated laser attach technology;optical power;direct butt-coupling;hybrid laser attach technology;si;integrated optics;integrated circuits;three-dimensional displays;semiconductor lasers;power lasers;silicon;photonics;semiconductor lasers;monolithic silicon photonics;hybrid integration;photonic integrated circuits"],"search_terms":["integrated","laser","attach","technology","300","monolithic","silicon","photonics","platform","bian","ramachandran","peng","hedrick","donegan","lubguban","fasano","rundquist","pape","sahin","houghton","nummy","steffes","medina","roy","cox","green","dezfulian","lee","stricker","mclean","hu","sowinski","meagher","aboketaf","rakowski","randall","melville","riggs","jacob","augur","berger","yu","giewont","pellerin"],"title":"3D Integrated Laser Attach Technology on 300-mm Monolithic Silicon Photonics Platform","year":2020}