Capacitive displacement sensor embedded in LTCC packaging

Capacitive displacement sensor embedded in LTCC packaging. Blaz, N., Maric, A., Zivanov, L., & Radosavljevic, G. In 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME), pages 59–62, Alba Iulia, Romania, October, 2012. IEEE.

Paper doi abstract bibtex

This paper presents the development of capacitive displacement sensor comprised of a movable dielectric stick and a fixed capacitor with a micro channel. Movement of the stick causes change of the sensor capacitance and therefore enables detection of the stick displacement in the plane. Electrical and mathematical sensor model have been developed. The sensor has been fabricated in the Low Temperature Co-fired Ceramics (LTCC) technology and experimentally characterized.

@inproceedings{blaz_capacitive_2012,
	address = {Alba Iulia, Romania},
	title = {Capacitive displacement sensor embedded in {LTCC} packaging},
	isbn = {978-1-4673-4760-0 978-1-4673-4757-0},
	url = {http://ieeexplore.ieee.org/document/6384346/},
	doi = {10.1109/SIITME.2012.6384346},
	abstract = {This paper presents the development of capacitive displacement sensor comprised of a movable dielectric stick and a fixed capacitor with a micro channel. Movement of the stick causes change of the sensor capacitance and therefore enables detection of the stick displacement in the plane. Electrical and mathematical sensor model have been developed. The sensor has been fabricated in the Low Temperature Co-fired Ceramics (LTCC) technology and experimentally characterized.},
	language = {en},
	urldate = {2019-06-27},
	booktitle = {2012 {IEEE} 18th {International} {Symposium} for {Design} and {Technology} in {Electronic} {Packaging} ({SIITME})},
	publisher = {IEEE},
	author = {Blaz, Nelu and Maric, Andrea and Zivanov, Ljiljana and Radosavljevic, Goran},
	month = oct,
	year = {2012},
	pages = {59--62},
}

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