Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system. Bosco, N. & Zok, F. Acta Materialia, 52(10):2965–2972, June, 2004.
Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system [link]Paper  doi  bibtex   
@article{bosco_critical_2004,
	title = {Critical interlayer thickness for transient liquid phase bonding in the {Cu}–{Sn} system},
	volume = {52},
	issn = {13596454},
	url = {https://linkinghub.elsevier.com/retrieve/pii/S1359645404001338},
	doi = {10.1016/j.actamat.2004.02.043},
	language = {en},
	number = {10},
	urldate = {2021-05-07},
	journal = {Acta Materialia},
	author = {Bosco, N.S. and Zok, F.W.},
	month = jun,
	year = {2004},
	pages = {2965--2972},
}

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