Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system. Bosco, N. & Zok, F. Acta Materialia, 52(10):2965–2972, June, 2004.
Paper doi bibtex @article{bosco_critical_2004,
title = {Critical interlayer thickness for transient liquid phase bonding in the {Cu}–{Sn} system},
volume = {52},
issn = {13596454},
url = {https://linkinghub.elsevier.com/retrieve/pii/S1359645404001338},
doi = {10.1016/j.actamat.2004.02.043},
language = {en},
number = {10},
urldate = {2021-05-07},
journal = {Acta Materialia},
author = {Bosco, N.S. and Zok, F.W.},
month = jun,
year = {2004},
pages = {2965--2972},
}
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