@inproceedings{conf/ecctd/BraunBRBBAVTKL15,
  added-at = {2025-02-03T00:00:00.000+0100},
  author = {Braun, Tanja and Becker, K.-F. and Raatz, S. and Bader, V. and Bauer, Jörg and Aschenbrenner, Rolf and Voges, S. and Thomas, Tina and Kahle, Ruben and Lang, Klaus-Dieter},
  biburl = {https://www.bibsonomy.org/bibtex/240781b3753eadb80d10ad9fa7c31dbde/dblp},
  booktitle = {ECCTD},
  crossref = {conf/ecctd/2015},
  ee = {https://doi.org/10.1109/ECCTD.2015.7300046},
  interhash = {4830f82bef3eed19d6797a2ac80eb6d0},
  intrahash = {40781b3753eadb80d10ad9fa7c31dbde},
  isbn = {978-1-4799-9877-7},
  keywords = {dblp},
  pages = {1-4},
  publisher = {IEEE},
  timestamp = {2025-02-10T07:13:15.000+0100},
  title = {From fan-out wafer to fan-out panel level packaging.},
  url = {http://dblp.uni-trier.de/db/conf/ecctd/ecctd2015.html#BraunBRBBAVTKL15},
  year = 2015
}

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