Study on reliability of PQFP assembly with lead free solder joints under random vibration test. Che, F. X. & Pang, J. H. L. Microelectronics Reliability, 55(12):2769-2776, 2015.
Study on reliability of PQFP assembly with lead free solder joints under random vibration test. [link]Link  Study on reliability of PQFP assembly with lead free solder joints under random vibration test. [link]Paper  bibtex   
@article{journals/mr/CheP15,
  added-at = {2016-01-06T00:00:00.000+0100},
  author = {Che, F. X. and Pang, John H. L.},
  biburl = {http://www.bibsonomy.org/bibtex/2d19f284d91a9ce983986c98c4ad6d4f8/dblp},
  ee = {http://dx.doi.org/10.1016/j.microrel.2015.09.010},
  interhash = {33a18b024676c67cfedf40af3ffde66a},
  intrahash = {d19f284d91a9ce983986c98c4ad6d4f8},
  journal = {Microelectronics Reliability},
  keywords = {dblp},
  number = 12,
  pages = {2769-2776},
  timestamp = {2016-01-07T11:36:52.000+0100},
  title = {Study on reliability of PQFP assembly with lead free solder joints under random vibration test.},
  url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#CheP15},
  volume = 55,
  year = 2015
}

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