Study on reliability of PQFP assembly with lead free solder joints under random vibration test. Che, F. X. & Pang, J. H. L. Microelectronics Reliability, 55(12):2769-2776, 2015. Link Paper bibtex @article{journals/mr/CheP15,
added-at = {2016-01-06T00:00:00.000+0100},
author = {Che, F. X. and Pang, John H. L.},
biburl = {http://www.bibsonomy.org/bibtex/2d19f284d91a9ce983986c98c4ad6d4f8/dblp},
ee = {http://dx.doi.org/10.1016/j.microrel.2015.09.010},
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journal = {Microelectronics Reliability},
keywords = {dblp},
number = 12,
pages = {2769-2776},
timestamp = {2016-01-07T11:36:52.000+0100},
title = {Study on reliability of PQFP assembly with lead free solder joints under random vibration test.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#CheP15},
volume = 55,
year = 2015
}
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