@article{journals/mr/CheP15,
  added-at = {2016-01-06T00:00:00.000+0100},
  author = {Che, F. X. and Pang, John H. L.},
  biburl = {http://www.bibsonomy.org/bibtex/2d19f284d91a9ce983986c98c4ad6d4f8/dblp},
  ee = {http://dx.doi.org/10.1016/j.microrel.2015.09.010},
  interhash = {33a18b024676c67cfedf40af3ffde66a},
  intrahash = {d19f284d91a9ce983986c98c4ad6d4f8},
  journal = {Microelectronics Reliability},
  keywords = {dblp},
  number = 12,
  pages = {2769-2776},
  timestamp = {2016-01-07T11:36:52.000+0100},
  title = {Study on reliability of PQFP assembly with lead free solder joints under random vibration test.},
  url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#CheP15},
  volume = 55,
  year = 2015
}

{"_id":"dAvBJzxeoMdXjGCQo","bibbaseid":"che-pang-studyonreliabilityofpqfpassemblywithleadfreesolderjointsunderrandomvibrationtest-2015","downloads":0,"creationDate":"2016-01-08T22:33:11.326Z","title":"Study on reliability of PQFP assembly with lead free solder joints under random vibration test.","author_short":["Che, F. X.","Pang, J. H. L."],"year":2015,"bibtype":"article","biburl":"http://www.bibsonomy.org/bib/author/john m peloquin?items=1000","bibdata":{"bibtype":"article","type":"article","added-at":"2016-01-06T00:00:00.000+0100","author":[{"propositions":[],"lastnames":["Che"],"firstnames":["F.","X."],"suffixes":[]},{"propositions":[],"lastnames":["Pang"],"firstnames":["John","H.","L."],"suffixes":[]}],"biburl":"http://www.bibsonomy.org/bibtex/2d19f284d91a9ce983986c98c4ad6d4f8/dblp","ee":"http://dx.doi.org/10.1016/j.microrel.2015.09.010","interhash":"33a18b024676c67cfedf40af3ffde66a","intrahash":"d19f284d91a9ce983986c98c4ad6d4f8","journal":"Microelectronics Reliability","keywords":"dblp","number":"12","pages":"2769-2776","timestamp":"2016-01-07T11:36:52.000+0100","title":"Study on reliability of PQFP assembly with lead free solder joints under random vibration test.","url":"http://dblp.uni-trier.de/db/journals/mr/mr55.html#CheP15","volume":"55","year":"2015","bibtex":"@article{journals/mr/CheP15,\n added-at = {2016-01-06T00:00:00.000+0100},\n author = {Che, F. X. and Pang, John H. L.},\n biburl = {http://www.bibsonomy.org/bibtex/2d19f284d91a9ce983986c98c4ad6d4f8/dblp},\n ee = {http://dx.doi.org/10.1016/j.microrel.2015.09.010},\n interhash = {33a18b024676c67cfedf40af3ffde66a},\n intrahash = {d19f284d91a9ce983986c98c4ad6d4f8},\n journal = {Microelectronics Reliability},\n keywords = {dblp},\n number = 12,\n pages = {2769-2776},\n timestamp = {2016-01-07T11:36:52.000+0100},\n title = {Study on reliability of PQFP assembly with lead free solder joints under random vibration test.},\n url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#CheP15},\n volume = 55,\n year = 2015\n}\n\n","author_short":["Che, F. X.","Pang, J. H. L."],"key":"journals/mr/CheP15","id":"journals/mr/CheP15","bibbaseid":"che-pang-studyonreliabilityofpqfpassemblywithleadfreesolderjointsunderrandomvibrationtest-2015","role":"author","urls":{"Link":"http://dx.doi.org/10.1016/j.microrel.2015.09.010","Paper":"http://dblp.uni-trier.de/db/journals/mr/mr55.html#CheP15"},"keyword":["dblp"],"downloads":0},"search_terms":["study","reliability","pqfp","assembly","lead","free","solder","joints","under","random","vibration","test","che","pang"],"keywords":["dblp"],"authorIDs":[],"dataSources":["7iBjTDWSdK27C35dP"]}