3D heterogeneous integration enabling future RF ICs. Chen, Q. & others In Radio and Wireless Symposium (RWS), 2018 IEEE, pages 188–190, 2018. IEEE. bibtex @inproceedings{chen20183d,
title={3D heterogeneous integration enabling future RF ICs},
author={Chen, Qi and others},
booktitle={Radio and Wireless Symposium (RWS), 2018 IEEE},
pages={188--190},
year={2018},
organization={IEEE}
}
Downloads: 0
{"_id":"EoEPLBoEpHbAsSJqc","bibbaseid":"chen-others-3dheterogeneousintegrationenablingfuturerfics-2018","downloads":0,"creationDate":"2018-10-25T09:30:38.835Z","title":"3D heterogeneous integration enabling future RF ICs","author_short":["Chen, Q.","others"],"year":2018,"bibtype":"inproceedings","biburl":"https://intra.ece.ucr.edu/~cwang/docs/publication.bib","bibdata":{"bibtype":"inproceedings","type":"inproceedings","title":"3D heterogeneous integration enabling future RF ICs","author":[{"propositions":[],"lastnames":["Chen"],"firstnames":["Qi"],"suffixes":[]},{"firstnames":[],"propositions":[],"lastnames":["others"],"suffixes":[]}],"booktitle":"Radio and Wireless Symposium (RWS), 2018 IEEE","pages":"188–190","year":"2018","organization":"IEEE","bibtex":"@inproceedings{chen20183d,\r\n title={3D heterogeneous integration enabling future RF ICs},\r\n author={Chen, Qi and others},\r\n booktitle={Radio and Wireless Symposium (RWS), 2018 IEEE},\r\n pages={188--190},\r\n year={2018},\r\n organization={IEEE}\r\n}\r\n\r\n","author_short":["Chen, Q.","others"],"key":"chen20183d","id":"chen20183d","bibbaseid":"chen-others-3dheterogeneousintegrationenablingfuturerfics-2018","role":"author","urls":{},"downloads":0,"html":""},"search_terms":["heterogeneous","integration","enabling","future","ics","chen","others"],"keywords":[],"authorIDs":[],"dataSources":["5eupXFsx8SWy5PusF"]}