3D heterogeneous integration enabling future RF ICs. Chen, Q. & others In Radio and Wireless Symposium (RWS), 2018 IEEE, pages 188–190, 2018. IEEE.
bibtex   
@inproceedings{chen20183d,
  title={3D heterogeneous integration enabling future RF ICs},
  author={Chen, Qi and others},
  booktitle={Radio and Wireless Symposium (RWS), 2018 IEEE},
  pages={188--190},
  year={2018},
  organization={IEEE}
}

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