@article{
 title = {Design and Development of a Package Using LCP for RF/Microwave MEMS Switches},
 type = {article},
 year = {2006},
 identifiers = {[object Object]},
 keywords = {electronics packaging;liquid crystal polymers;micr},
 pages = {4009-4015},
 volume = {54},
 month = {11},
 id = {99dc1d28-b657-3084-8380-5a7c50051eae},
 created = {2020-04-13T20:08:31.106Z},
 file_attached = {false},
 profile_id = {ac5c8e47-7448-34f1-9dda-fe44957f5950},
 group_id = {ebb0c10c-30f1-31a4-b724-9e94c775c126},
 last_modified = {2020-04-13T20:08:31.106Z},
 read = {false},
 starred = {false},
 authored = {false},
 confirmed = {true},
 hidden = {false},
 citation_key = {1717772},
 source_type = {article},
 private_publication = {false},
 abstract = {We present the development of an ultrahigh moisture-resistant enclosure for RF microelectromechanical system (MEMS) switches using liquid-crystal polymer (LCP). A cavity formed in LCP has been laminated, at low temperature, onto a silicon MEMS switch to create a package. The LCP-cap package has an insertion loss of less than 0.2 dB at X-band. E595 outgas tests demonstrate that the LCP material is suitable for constructing reliable packages without interfering with the operation of the MEMS switch. The package also passes Method 1014, MIL-STD-883 gross leak, and fine leak hermeticity tests},
 bibtype = {article},
 author = {Chen, M J and Pham, A -. H and Evers, N A and Kapusta, C and Iannotti, J and Kornrumpf, W and Maciel, J and Karabudak, N},
 journal = {IEEE Transactions on Microwave Theory and Techniques},
 number = {11}
}

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