Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver. Choe, C., Noh, S., Chen, C., Kim, D., & Suganuma, K. Microelectronics Reliability, 88-90:695-700, 2018.
Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver. [link]Link  Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver. [link]Paper  bibtex   
@article{journals/mr/ChoeNCKS18,
  added-at = {2019-01-07T00:00:00.000+0100},
  author = {Choe, Chanyang and Noh, Seungjun and Chen, Chuantong and Kim, Dongjin and Suganuma, Katsuaki},
  biburl = {https://www.bibsonomy.org/bibtex/273665b1355e52010b774bd58b5acaea2/dblp},
  ee = {https://doi.org/10.1016/j.microrel.2018.07.048},
  interhash = {d23c93fa19e7786c98f9a402a942b23e},
  intrahash = {73665b1355e52010b774bd58b5acaea2},
  journal = {Microelectronics Reliability},
  keywords = {dblp},
  pages = {695-700},
  timestamp = {2019-01-08T11:37:45.000+0100},
  title = {Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver.},
  url = {http://dblp.uni-trier.de/db/journals/mr/mr88.html#ChoeNCKS18},
  volume = {88-90},
  year = 2018
}

Downloads: 0