Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver. Choe, C., Noh, S., Chen, C., Kim, D., & Suganuma, K. Microelectronics Reliability, 88-90:695-700, 2018. Link Paper bibtex @article{journals/mr/ChoeNCKS18,
added-at = {2019-01-07T00:00:00.000+0100},
author = {Choe, Chanyang and Noh, Seungjun and Chen, Chuantong and Kim, Dongjin and Suganuma, Katsuaki},
biburl = {https://www.bibsonomy.org/bibtex/273665b1355e52010b774bd58b5acaea2/dblp},
ee = {https://doi.org/10.1016/j.microrel.2018.07.048},
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intrahash = {73665b1355e52010b774bd58b5acaea2},
journal = {Microelectronics Reliability},
keywords = {dblp},
pages = {695-700},
timestamp = {2019-01-08T11:37:45.000+0100},
title = {Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr88.html#ChoeNCKS18},
volume = {88-90},
year = 2018
}
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