Effect of EBG Structures for Reducing Noise in Multi-Layer PCBs for Digital Systems. Chung, D., Kim, T. H., Ryu, C., Engin, E., Swaminathan, M., & Kim, J. In Proc. Electrical Performance of Electronic Packaging, pages 253-256, Scottsdale, AZ, October, 2006.
bibtex   
@inproceedings{engin06_16,
  author        = "Daehyun Chung and Tae Hong Kim and Chunghyun Ryu and Ege Engin and Madhavan Swaminathan and Joungho Kim",
  title         = "Effect of EBG Structures for Reducing Noise in Multi-Layer PCBs for Digital Systems",
  booktitle     = epep,
  address       = "Scottsdale, AZ",
  month         = oct,
  year          = "2006",
  pages         = "253-256"
}
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