Effect of EBG Structures for Reducing Noise in Multi-Layer PCBs for Digital Systems. Chung, D., Kim, T. H., Ryu, C., Engin, E., Swaminathan, M., & Kim, J. In Proc. Electrical Performance of Electronic Packaging, pages 253-256, Scottsdale, AZ, October, 2006. bibtex @inproceedings{engin06_16,
author = "Daehyun Chung and Tae Hong Kim and Chunghyun Ryu and Ege Engin and Madhavan Swaminathan and Joungho Kim",
title = "Effect of EBG Structures for Reducing Noise in Multi-Layer PCBs for Digital Systems",
booktitle = epep,
address = "Scottsdale, AZ",
month = oct,
year = "2006",
pages = "253-256"
}