@InProceedings{CSFRKB18,
  author    = {C. Clifford and S. Sammak and A. Fradeneck and J. Rivero and M. Kimber and M. Barry,},
  title     = {{Thermal-Fluid-Electric Coupling Modeling of Novel Pin-Fin Integrated Themoelectric Devices - the Effect of Packing Density on Performance,}},
  booktitle = {3rd Thermal and Fluids Engineering Conference},
  year      = {2018},
url={https://www.astfe.org/conferences/tfec2018/TFEC2018_Conference_program.pdf},
  note      = {TFEC-2018-21737},
  month     = {March 4--7},
  address   = {Fort Lauderdale, FL},
  owner     = {Shervin},
  timestamp = {2018.09.05},
}

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