Transient Current Capacities of Bond Wires in Hybrid Microcircuits. Coxon, M., Kershner, C., & McEligot, D. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 9(3):279–285, Institute of Electrical and Electronics Engineers (IEEE), September, 1986.
doi  bibtex   
@Article{         Coxon_1986aa,
  author        = {Coxon, M. and Kershner, C. and McEligot, D.},
  citable       = {1},
  doi           = {10.1109/tchmt.1986.1136651},
  file          = {Coxon_1986aa.pdf},
  group         = {casper},
  internal      = {0},
  issn          = {0148-6411},
  journal       = {IEEE Transactions on Components, Hybrids, and Manufacturing Technology},
  keywords      = {bondwires,electrothermal,electronics,measurements},
  langid        = {english},
  month         = sep,
  number        = {3},
  pages         = {279--285},
  publisher     = {Institute of Electrical {and} Electronics Engineers ({IEEE})},
  title         = {Transient Current Capacities of Bond Wires in Hybrid Microcircuits},
  volume        = {9},
  year          = {1986},
  shortjournal  = {IEEE Trans. Compon., Hybrids, and Manuf. Technol.}
}

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