Transient Current Capacities of Bond Wires in Hybrid Microcircuits. Coxon, M., Kershner, C., & McEligot, D. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 9(3):279–285, Institute of Electrical and Electronics Engineers (IEEE), September, 1986. doi bibtex @Article{ Coxon_1986aa,
author = {Coxon, M. and Kershner, C. and McEligot, D.},
citable = {1},
doi = {10.1109/tchmt.1986.1136651},
file = {Coxon_1986aa.pdf},
group = {casper},
internal = {0},
issn = {0148-6411},
journal = {IEEE Transactions on Components, Hybrids, and Manufacturing Technology},
keywords = {bondwires,electrothermal,electronics,measurements},
langid = {english},
month = sep,
number = {3},
pages = {279--285},
publisher = {Institute of Electrical {and} Electronics Engineers ({IEEE})},
title = {Transient Current Capacities of Bond Wires in Hybrid Microcircuits},
volume = {9},
year = {1986},
shortjournal = {IEEE Trans. Compon., Hybrids, and Manuf. Technol.}
}
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