Multiscale simulations of copper electrodeposition onto a resistive substrate. Drews, T., O., Krishnan, S., Alameda, J., C., Gannon, D., Braatz, R., D., & Alkire, R., C. IBM journal of research and development, 49(1):49-63, IBM, 2005.
bibtex   
@article{
 title = {Multiscale simulations of copper electrodeposition onto a resistive substrate},
 type = {article},
 year = {2005},
 pages = {49-63},
 volume = {49},
 publisher = {IBM},
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 bibtype = {article},
 author = {Drews, Timothy O and Krishnan, Sriram and Alameda, J C and Gannon, Dennis and Braatz, Richard D and Alkire, Richard C},
 journal = {IBM journal of research and development},
 number = {1}
}

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