Multiscale simulations of copper electrodeposition onto a resistive substrate. Drews,  T., O., Krishnan,  S., Alameda,  J., C., Gannon,  D., Braatz,  R., D., & Alkire,  R., C. IBM journal of research and development, 49(1):49-63, IBM, 2005.  bibtex   @article{
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