@article{journals/mr/EkpuBOMO14,
  added-at = {2020-02-22T00:00:00.000+0100},
  author = {Ekpu, Mathias and Bhatti, Raj S. and Okereke, Michael I. and Mallik, Sabuj and Otiaba, Kenny C.},
  biburl = {https://www.bibsonomy.org/bibtex/2e3eaf89e524deacbd013888b0039e799/dblp},
  ee = {https://doi.org/10.1016/j.microrel.2013.08.006},
  interhash = {7ecd289ea54c8ece123c94cd06263056},
  intrahash = {e3eaf89e524deacbd013888b0039e799},
  journal = {Microelectron. Reliab.},
  keywords = {dblp},
  number = 1,
  pages = {239-244},
  timestamp = {2020-02-25T13:28:18.000+0100},
  title = {Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.},
  url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#EkpuBOMO14},
  volume = 54,
  year = 2014
}

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