@INPROCEEDINGS{6351759, 
author={Engin, A.E. and Raghavan, N.S.}, 
booktitle={Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on}, 
title={Modeling of coupled TSVs in 3D ICs}, 
year={2012}, 
pages={7-11}, 
keywords={MOS capacitors;crosstalk;equivalent circuits;integrated circuit modelling;multiconductor transmission lines;three-dimensional integrated circuits;varactors;2D quasistatic simulations;3D IC;3D full-wave electromagnetic simulations;3D integrated circuit system;MIS transmission lines;circuit simulators;coupled TSV structure modelling;coupled through silicon via structures;crosstalk behavior analysis;dielectric quasiTEM modes;equivalent circuit model;lossy silicon medium;metal-insulator-semiconductor transmission lines;metal-oxide-semiconductor varactor capacitance;multiconductor transmission line approach;slow-wave TEM modes;Capacitance;Inductance;Integrated circuit modeling;Silicon;Solid modeling;Through-silicon vias;Transmission line matrix methods}, 
doi={10.1109/ISEMC.2012.6351759}, 
ISSN={2158-110X},}

{"_id":"rmpBTzLdGYiWrNDQq","bibbaseid":"engin-raghavan-modelingofcoupledtsvsin3dics-2012","downloads":0,"creationDate":"2018-08-27T18:24:07.857Z","title":"Modeling of coupled TSVs in 3D ICs","author_short":["Engin, A.","Raghavan, N."],"year":2012,"bibtype":"inproceedings","biburl":"http://eon.sdsu.edu/~engin/mybib.bib","bibdata":{"bibtype":"inproceedings","type":"inproceedings","author":[{"propositions":[],"lastnames":["Engin"],"firstnames":["A.E."],"suffixes":[]},{"propositions":[],"lastnames":["Raghavan"],"firstnames":["N.S."],"suffixes":[]}],"booktitle":"Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on","title":"Modeling of coupled TSVs in 3D ICs","year":"2012","pages":"7-11","keywords":"MOS capacitors;crosstalk;equivalent circuits;integrated circuit modelling;multiconductor transmission lines;three-dimensional integrated circuits;varactors;2D quasistatic simulations;3D IC;3D full-wave electromagnetic simulations;3D integrated circuit system;MIS transmission lines;circuit simulators;coupled TSV structure modelling;coupled through silicon via structures;crosstalk behavior analysis;dielectric quasiTEM modes;equivalent circuit model;lossy silicon medium;metal-insulator-semiconductor transmission lines;metal-oxide-semiconductor varactor capacitance;multiconductor transmission line approach;slow-wave TEM modes;Capacitance;Inductance;Integrated circuit modeling;Silicon;Solid modeling;Through-silicon vias;Transmission line matrix methods","doi":"10.1109/ISEMC.2012.6351759","issn":"2158-110X","bibtex":"@INPROCEEDINGS{6351759, \nauthor={Engin, A.E. and Raghavan, N.S.}, \nbooktitle={Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on}, \ntitle={Modeling of coupled TSVs in 3D ICs}, \nyear={2012}, \npages={7-11}, \nkeywords={MOS capacitors;crosstalk;equivalent circuits;integrated circuit modelling;multiconductor transmission lines;three-dimensional integrated circuits;varactors;2D quasistatic simulations;3D IC;3D full-wave electromagnetic simulations;3D integrated circuit system;MIS transmission lines;circuit simulators;coupled TSV structure modelling;coupled through silicon via structures;crosstalk behavior analysis;dielectric quasiTEM modes;equivalent circuit model;lossy silicon medium;metal-insulator-semiconductor transmission lines;metal-oxide-semiconductor varactor capacitance;multiconductor transmission line approach;slow-wave TEM modes;Capacitance;Inductance;Integrated circuit modeling;Silicon;Solid modeling;Through-silicon vias;Transmission line matrix methods}, \ndoi={10.1109/ISEMC.2012.6351759}, \nISSN={2158-110X},}\n\n\n","author_short":["Engin, A.","Raghavan, N."],"key":"6351759","id":"6351759","bibbaseid":"engin-raghavan-modelingofcoupledtsvsin3dics-2012","role":"author","urls":{},"keyword":["MOS capacitors;crosstalk;equivalent circuits;integrated circuit modelling;multiconductor transmission lines;three-dimensional integrated circuits;varactors;2D quasistatic simulations;3D IC;3D full-wave electromagnetic simulations;3D integrated circuit system;MIS transmission lines;circuit simulators;coupled TSV structure modelling;coupled through silicon via structures;crosstalk behavior analysis;dielectric quasiTEM modes;equivalent circuit model;lossy silicon medium;metal-insulator-semiconductor transmission lines;metal-oxide-semiconductor varactor capacitance;multiconductor transmission line approach;slow-wave TEM modes;Capacitance;Inductance;Integrated circuit modeling;Silicon;Solid modeling;Through-silicon vias;Transmission line matrix methods"],"downloads":0,"html":""},"search_terms":["modeling","coupled","tsvs","ics","engin","raghavan"],"keywords":["mos capacitors;crosstalk;equivalent circuits;integrated circuit modelling;multiconductor transmission lines;three-dimensional integrated circuits;varactors;2d quasistatic simulations;3d ic;3d full-wave electromagnetic simulations;3d integrated circuit system;mis transmission lines;circuit simulators;coupled tsv structure modelling;coupled through silicon via structures;crosstalk behavior analysis;dielectric quasitem modes;equivalent circuit model;lossy silicon medium;metal-insulator-semiconductor transmission lines;metal-oxide-semiconductor varactor capacitance;multiconductor transmission line approach;slow-wave tem modes;capacitance;inductance;integrated circuit modeling;silicon;solid modeling;through-silicon vias;transmission line matrix methods"],"authorIDs":[],"dataSources":["ewJKWhfbA3A46G2BD"]}