Metal Semiconductor (MES) TSVs in 3D ICs: Electrical Modeling and Design. Engin, A. E. & Raghavan N., S. In IEEE International 3D System Integration Conference (3DIC) , February, 2012.
bibtex   
@INPROCEEDINGS{engin_3dic12, 
author={Engin, A. Ege and Raghavan N., Srinidhi}, 
booktitle={{IEEE} International 3D System Integration Conference (3DIC) 
}, 
title={Metal Semiconductor {(MES) TSV}s in {3D IC}s: Electrical Modeling and Design}, 
year={2012}, 
month=feb, 
volume={}, 
number={}, 
pages={}, 
keywords={}, 
doi={}, 
ISSN={},}
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