{"_id":"47xqZsFZ6suhZdjKZ","bibbaseid":"engin-raghavann-metalsemiconductormestsvsin3dicselectricalmodelinganddesign-2012","downloads":0,"creationDate":"2018-08-27T18:24:07.918Z","title":"Metal Semiconductor (MES) TSVs in 3D ICs: Electrical Modeling and Design","author_short":["Engin, A. E.","Raghavan N., S."],"year":2012,"bibtype":"inproceedings","biburl":"http://eon.sdsu.edu/~engin/mybib.bib","bibdata":{"bibtype":"inproceedings","type":"inproceedings","author":[{"propositions":[],"lastnames":["Engin"],"firstnames":["A.","Ege"],"suffixes":[]},{"propositions":[],"lastnames":["Raghavan","N."],"firstnames":["Srinidhi"],"suffixes":[]}],"booktitle":"IEEE International 3D System Integration Conference (3DIC) ","title":"Metal Semiconductor (MES) TSVs in 3D ICs: Electrical Modeling and Design","year":"2012","month":"February","volume":"","number":"","pages":"","keywords":"","doi":"","issn":"","bibtex":"@INPROCEEDINGS{engin_3dic12, \nauthor={Engin, A. Ege and Raghavan N., Srinidhi}, \nbooktitle={{IEEE} International 3D System Integration Conference (3DIC) \n}, \ntitle={Metal Semiconductor {(MES) TSV}s in {3D IC}s: Electrical Modeling and Design}, \nyear={2012}, \nmonth=feb, \nvolume={}, \nnumber={}, \npages={}, \nkeywords={}, \ndoi={}, \nISSN={},}\n\n","author_short":["Engin, A. E.","Raghavan N., S."],"key":"engin_3dic12","id":"engin_3dic12","bibbaseid":"engin-raghavann-metalsemiconductormestsvsin3dicselectricalmodelinganddesign-2012","role":"author","urls":{},"downloads":0,"html":""},"search_terms":["metal","semiconductor","mes","tsvs","ics","electrical","modeling","design","engin","raghavan n."],"keywords":[],"authorIDs":[],"dataSources":["ewJKWhfbA3A46G2BD"]}