@article{ ISI:A1997XH86600033,
Author = {Eom, CB and Huang, L and Rao, RA and Tong, QY and Gosele, U},
Title = {{Fabrication of double sided YBa2Cu3O7 thin films on 2 inch diameter
   LaAlO3 wafers by direct wafer bonding}},
Journal = {{IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY}},
Year = {{1997}},
Volume = {{7}},
Number = {{2, 2}},
Pages = {{1244-1248}},
Month = {{JUN}},
Note = {{1996 Applied Superconductivity Conference, PITTSBURGH, PA, AUG 25-30,
   1996}},
Abstract = {{We have demonstrated a novel fabrication process for double sided
   YBa2Cu3O7 (YBCO) thin film on 2 inch diameter (100) LaAlO3 wafers by
   direct wafer bonding. YBCO thin films were deposited on one side of two
   LaAlO3 wafers by a 90 degrees wafers were then polished on the opposite
   side and directly bonded at room temperature. We have also developed and
   optimized the process of LaAlO3 wafer bonding. The effect of annealing
   on the roughness, twin structure and bonding strength of bonded LaAlO3
   wafers has been investigated. After annealing at 120 degrees C for 100
   hours, the bonded LaAlO3 pairs remained intact even after immersion in
   deionized water for 20 hours. This process can be used for fabricating
   double sided high temperature superconducting thin films on
   heterostructure substrates, which have important applications in high
   frequency devices.}},
DOI = {{10.1109/77.620739}},
ISSN = {{1051-8223}},
ResearcherID-Numbers = {{Eom, Chang-Beom/I-5567-2014}},
Unique-ID = {{ISI:A1997XH86600033}},
}

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