@inproceedings{
 title = {Numerical approaches for EMI reduction of ICs and PCBs inside metallic enclosures},
 type = {inproceedings},
 year = {2003},
 pages = {513-516 Vol.1},
 websites = {%3CGo},
 publisher = {Ieee},
 id = {6f8c8659-6591-33c8-aff3-a790477b08f9},
 created = {2020-03-03T08:46:35.431Z},
 file_attached = {false},
 profile_id = {c69aa657-d754-373c-91b7-64154b7d5d91},
 last_modified = {2023-02-11T20:59:41.564Z},
 read = {false},
 starred = {false},
 authored = {true},
 confirmed = {true},
 hidden = {false},
 citation_key = {Goudos2003},
 source_type = {inproceedings},
 private_publication = {false},
 abstract = {This work presents a numerical approach to the reduction of Electromagnetic Interference (EMI) from the emissions of 1Cs and PCBs inside rectangular metallic enclosures. The ICs are modeled as small magnetic dipoles. Their interaction with the enclosures is studied with the dyadic Green's functions. The Monte Carlo procedure in conjunction with optimization techniques is used in order to achieve optimal placement configurations for the ICs. by minimizing the electric current density on the metallic walls. The applications of the above approach in PCB design are discussed.},
 bibtype = {inproceedings},
 author = {Goudos, S and Samaras, T and Vafiadis, E and Sahalos, J.N.},
 doi = {10.1109/icsmc2.2003.1428305},
 booktitle = {IEEE International Symposium on Electromagnetic Compatibility (EMC)}
}

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