Counterfeit Integrated Circuits: A Rising Threat in the Global Semiconductor Supply Chain. Guin, U., Huang, K., DiMase, D., Carulli, J. M., Tehranipoor, M., & Makris, Y. Proceedings of the IEEE, 102(8):1207–1228, August, 2014. doi abstract bibtex As the electronic component supply chain grows more complex due to globalization, with parts coming from a diverse set of suppliers, counterfeit electronics have become a major challenge that calls for immediate solutions. Currently, there are a few standards and programs available that address the testing for such counterfeit parts. However, not enough research has yet addressed the detection and avoidance of all counterfeit parts-recycled, remarked, overproduced, cloned, out-of-spec/defective, and forged documentation-currently infiltrating the electronic component supply chain. Even if they work initially, all these parts may have reduced lifetime and pose reliability risks. In this tutorial, we will provide a review of some of the existing counterfeit detection and avoidance methods. We will also discuss the challenges ahead for implementing these methods, as well as the development of new detection and avoidance mechanisms.
@article{guin_counterfeit_2014,
title = {Counterfeit {Integrated} {Circuits}: {A} {Rising} {Threat} in the {Global} {Semiconductor} {Supply} {Chain}},
volume = {102},
issn = {0018-9219},
shorttitle = {Counterfeit {Integrated} {Circuits}},
doi = {10.1109/JPROC.2014.2332291},
abstract = {As the electronic component supply chain grows more complex due to globalization, with parts coming from a diverse set of suppliers, counterfeit electronics have become a major challenge that calls for immediate solutions. Currently, there are a few standards and programs available that address the testing for such counterfeit parts. However, not enough research has yet addressed the detection and avoidance of all counterfeit parts-recycled, remarked, overproduced, cloned, out-of-spec/defective, and forged documentation-currently infiltrating the electronic component supply chain. Even if they work initially, all these parts may have reduced lifetime and pose reliability risks. In this tutorial, we will provide a review of some of the existing counterfeit detection and avoidance methods. We will also discuss the challenges ahead for implementing these methods, as well as the development of new detection and avoidance mechanisms.},
number = {8},
journal = {Proceedings of the IEEE},
author = {Guin, U. and Huang, K. and DiMase, D. and Carulli, J. M. and Tehranipoor, M. and Makris, Y.},
month = aug,
year = {2014},
keywords = {AC/DC parametric tests, Consumer electronics, Globalization, Hardware, Integrated circuit modeling, Integrated circuits, Semiconductor device measurement, Semiconductor devices, Supply chain management, Supply chains, counterfeit avoidance methods, counterfeit detection methods, counterfeit integrated circuits, counterfeit integrated circuits (ICs), electrical inspection, electronic component supply chain, global semiconductor supply chain, globalization, hardware security, integrated circuits, machine learning, path-delay test, physical inspection, reliability, reliability risk, risk management, supply chain management},
pages = {1207--1228},
}
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