@Article{         Hefner_1994aa,
  author        = {Hefner, A.R. and Blackburn, D.L.},
  citable       = {1},
  doi           = {10.1109/95.311751},
  file          = {Hefner_1994aa.pdf},
  group         = {casper},
  internal      = {0},
  issn          = {1070-9886},
  journal       = {IEEE Transactions on Components, Packaging, and Manufacturing Technology -- Part A},
  keywords      = {circuit analysis computing,digital simulation,equivalent circuits,heat sinks,packaging,semiconductor device models,temperature distribution,thermal analysis,currents,electrical network,electrothermal network simulation,heat sinks,model interconnection,packages,semiconductor devices,temperature distribution,temperature measurement methods,thermal component models,voltages,Circuit simulation,Electronic packaging thermal management,Electrothermal effects,Heat sinks,Integrated circuit interconnections,Resistance heating,Semiconductor device packaging,Semiconductor devices,Temperature distribution,Voltage},
  langid        = {english},
  month         = sep,
  number        = {3},
  owner         = {TC},
  pages         = {413--424},
  timestamp     = {2015.10.29},
  title         = {Thermal component models for electrothermal network simulation},
  volume        = {17},
  year          = {1994},
  shortjournal  = {IEEE Trans. Compon. Packag. Manuf. A}
}

{"_id":"bhwcF5y5ZrF6NpxDr","bibbaseid":"hefner-blackburn-thermalcomponentmodelsforelectrothermalnetworksimulation-1994","authorIDs":[],"author_short":["Hefner, A.","Blackburn, D."],"bibdata":{"bibtype":"article","type":"article","author":[{"propositions":[],"lastnames":["Hefner"],"firstnames":["A.R."],"suffixes":[]},{"propositions":[],"lastnames":["Blackburn"],"firstnames":["D.L."],"suffixes":[]}],"citable":"1","doi":"10.1109/95.311751","file":"Hefner_1994aa.pdf","group":"casper","internal":"0","issn":"1070-9886","journal":"IEEE Transactions on Components, Packaging, and Manufacturing Technology – Part A","keywords":"circuit analysis computing,digital simulation,equivalent circuits,heat sinks,packaging,semiconductor device models,temperature distribution,thermal analysis,currents,electrical network,electrothermal network simulation,heat sinks,model interconnection,packages,semiconductor devices,temperature distribution,temperature measurement methods,thermal component models,voltages,Circuit simulation,Electronic packaging thermal management,Electrothermal effects,Heat sinks,Integrated circuit interconnections,Resistance heating,Semiconductor device packaging,Semiconductor devices,Temperature distribution,Voltage","langid":"english","month":"September","number":"3","owner":"TC","pages":"413–424","timestamp":"2015.10.29","title":"Thermal component models for electrothermal network simulation","volume":"17","year":"1994","shortjournal":"IEEE Trans. Compon. Packag. Manuf. A","bibtex":"@Article{ Hefner_1994aa,\n author = {Hefner, A.R. and Blackburn, D.L.},\n citable = {1},\n doi = {10.1109/95.311751},\n file = {Hefner_1994aa.pdf},\n group = {casper},\n internal = {0},\n issn = {1070-9886},\n journal = {IEEE Transactions on Components, Packaging, and Manufacturing Technology -- Part A},\n keywords = {circuit analysis computing,digital simulation,equivalent circuits,heat sinks,packaging,semiconductor device models,temperature distribution,thermal analysis,currents,electrical network,electrothermal network simulation,heat sinks,model interconnection,packages,semiconductor devices,temperature distribution,temperature measurement methods,thermal component models,voltages,Circuit simulation,Electronic packaging thermal management,Electrothermal effects,Heat sinks,Integrated circuit interconnections,Resistance heating,Semiconductor device packaging,Semiconductor devices,Temperature distribution,Voltage},\n langid = {english},\n month = sep,\n number = {3},\n owner = {TC},\n pages = {413--424},\n timestamp = {2015.10.29},\n title = {Thermal component models for electrothermal network simulation},\n volume = {17},\n year = {1994},\n shortjournal = {IEEE Trans. Compon. Packag. Manuf. A}\n}\n\n","author_short":["Hefner, A.","Blackburn, D."],"key":"Hefner_1994aa","id":"Hefner_1994aa","bibbaseid":"hefner-blackburn-thermalcomponentmodelsforelectrothermalnetworksimulation-1994","role":"author","urls":{},"keyword":["circuit analysis computing","digital simulation","equivalent circuits","heat sinks","packaging","semiconductor device models","temperature distribution","thermal analysis","currents","electrical network","electrothermal network simulation","heat sinks","model interconnection","packages","semiconductor devices","temperature distribution","temperature measurement methods","thermal component models","voltages","Circuit simulation","Electronic packaging thermal management","Electrothermal effects","Heat sinks","Integrated circuit interconnections","Resistance heating","Semiconductor device packaging","Semiconductor devices","Temperature distribution","Voltage"],"downloads":0,"html":""},"bibtype":"article","biburl":"http://dl.schoeps.org/database.bib","creationDate":"2019-12-26T16:51:17.354Z","downloads":0,"keywords":["circuit analysis computing","digital simulation","equivalent circuits","heat sinks","packaging","semiconductor device models","temperature distribution","thermal analysis","currents","electrical network","electrothermal network simulation","heat sinks","model interconnection","packages","semiconductor devices","temperature distribution","temperature measurement methods","thermal component models","voltages","circuit simulation","electronic packaging thermal management","electrothermal effects","heat sinks","integrated circuit interconnections","resistance heating","semiconductor device packaging","semiconductor devices","temperature distribution","voltage"],"search_terms":["thermal","component","models","electrothermal","network","simulation","hefner","blackburn"],"title":"Thermal component models for electrothermal network simulation","year":1994,"dataSources":["P4aBgbzF45TWvxzbZ"]}