First-pass-silicon radio IPs for B3G wireless networks. Ismail, M. In Proceedings - SBCCI 2007: 20th Symposium on Integrated Circuits and System Design, 2007. abstract bibtex As we move from third generation (3G) to 4G wireless and as we strive to meet the demands for higher data rates and short distance wireless applications, a debate has ensued on whether cellular and WLAN/WMAN are seen as complementary or competing technologies. In either case, wireless services beyond 3G (B3G) are moving to all-IP, always-best-connected, convergent wireless solutions requiring access to different wireless infrastructures from the same wireless device, be it a cell phone, a laptop or a PDA for a multitude of services including voice, data and multimedia applications. For future handheld wireless devices, this requires low power, low cost multi-standard multi-band chipsets, the radio part of which will be increasingly complex with stringent demands on power consumption and cost as the two main differentiators. We will present radio design IPs at the system, architectural and block levels for emerging always-best-connected wireless applications and with focus on smart power, first-pass-silicon radio transceiver design in deep sub-micron CMOS. We will highlight both the challenges and the opportunities for innovation in this area.
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title = {First-pass-silicon radio IPs for B3G wireless networks},
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abstract = {As we move from third generation (3G) to 4G wireless and as we strive to meet the demands for higher data rates and short distance wireless applications, a debate has ensued on whether cellular and WLAN/WMAN are seen as complementary or competing technologies. In either case, wireless services beyond 3G (B3G) are moving to all-IP, always-best-connected, convergent wireless solutions requiring access to different wireless infrastructures from the same wireless device, be it a cell phone, a laptop or a PDA for a multitude of services including voice, data and multimedia applications. For future handheld wireless devices, this requires low power, low cost multi-standard multi-band chipsets, the radio part of which will be increasingly complex with stringent demands on power consumption and cost as the two main differentiators. We will present radio design IPs at the system, architectural and block levels for emerging always-best-connected wireless applications and with focus on smart power, first-pass-silicon radio transceiver design in deep sub-micron CMOS. We will highlight both the challenges and the opportunities for innovation in this area.},
bibtype = {inProceedings},
author = {Ismail, M.},
booktitle = {Proceedings - SBCCI 2007: 20th Symposium on Integrated Circuits and System Design}
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