Thermal Microstructural Analysis Of Anodic And Electrolytic Copper Solidification: Simulation And Experimental Validation. Http://Dx.Doi.Org/10.1007/S11663-011-9483-8. J., R., D., C., & M., C. Metallurgical And Materials Transactions B-Process Metallurgy And Materials Processing Science, 2011. doi bibtex @article{Paper_000183,
title = {Thermal Microstructural Analysis Of Anodic And Electrolytic Copper Solidification: Simulation And Experimental Validation. Http://Dx.Doi.Org/10.1007/S11663-011-9483-8},
author = {Romero J. and Celentano D. and Cruchaga M.},
journal = {Metallurgical And Materials Transactions B-Process Metallurgy And Materials Processing Science},
volume = {42},
number = {3},
doi = {10.1007/s11663-011-9483-8},
year = {2011}}
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