@incollection{JACOB2023369,
title = {Photonic-integrated circuit fabrication and test approaches},
editor = {Madeleine Glick and Ling Liao and Katharine Schmidtke},
booktitle = {Integrated Photonics for Data Communication Applications},
publisher = {Elsevier},
pages = {369-410},
year = {2023},
series = {Integrated Photonics Apps Specific Design &Manufacturing},
isbn = {978-0-323-91224-2},
doi = {https://doi.org/10.1016/B978-0-323-91224-2.00012-6},
url = {https://www.sciencedirect.com/science/article/pii/B9780323912242000126},
author = {Ajey P. Jacob and Sujith Chandran and Joris {Van Campenhout} and Marianna Pantouvaki and John Heck and Ken Giewont and Michal Rakowski and Yusheng Bian and Peter Debackere and Matthias Kuntz},
keywords = {Photonic-integrated circuit, high-volume manufacturing, monolithic photonic-integrated circuit, heterogeneous photonic-integrated circuit, hybrid photonic-integrated circuit, fully photonic-integrated circuit, InP III–V photonic-integrated circuit, photonics in-line and end-of-line testing},
abstract = {Photonic-integrated circuits (PICs) integrate photonics elements, such as light sources, passive and active components, along with electronics elements, such as drivers, amplifiers, and application-specific integrated circuits, on a homogeneous or a heterogeneous material platform for various applications, such as data centers, communications, LIDAR, sensors, and spectroscopy. These components are fabricated separately or assembled monolithically on the silicon line to form the PIC. This chapter discusses the various chip fabrication and testing schemes leading to high-volume manufacturing of the PIC, such as (1) hybrid, (2) heterogeneous, (3) monolithic, (4) fully monolithic on silicon, and (5) indium phosphide III–V material platforms.}
}

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P.","Chandran, S.","Van Campenhout, J.","Pantouvaki, M.","Heck, J.","Giewont, K.","Rakowski, M.","Bian, Y.","Debackere, P.","Kuntz, M."],"bibdata":{"bibtype":"incollection","type":"incollection","title":"Photonic-integrated circuit fabrication and test approaches","editor":[{"firstnames":["Madeleine"],"propositions":[],"lastnames":["Glick"],"suffixes":[]},{"firstnames":["Ling"],"propositions":[],"lastnames":["Liao"],"suffixes":[]},{"firstnames":["Katharine"],"propositions":[],"lastnames":["Schmidtke"],"suffixes":[]}],"booktitle":"Integrated Photonics for Data Communication Applications","publisher":"Elsevier","pages":"369-410","year":"2023","series":"Integrated Photonics Apps Specific Design &Manufacturing","isbn":"978-0-323-91224-2","doi":"https://doi.org/10.1016/B978-0-323-91224-2.00012-6","url":"https://www.sciencedirect.com/science/article/pii/B9780323912242000126","author":[{"firstnames":["Ajey","P."],"propositions":[],"lastnames":["Jacob"],"suffixes":[]},{"firstnames":["Sujith"],"propositions":[],"lastnames":["Chandran"],"suffixes":[]},{"firstnames":["Joris"],"propositions":[],"lastnames":["Van Campenhout"],"suffixes":[]},{"firstnames":["Marianna"],"propositions":[],"lastnames":["Pantouvaki"],"suffixes":[]},{"firstnames":["John"],"propositions":[],"lastnames":["Heck"],"suffixes":[]},{"firstnames":["Ken"],"propositions":[],"lastnames":["Giewont"],"suffixes":[]},{"firstnames":["Michal"],"propositions":[],"lastnames":["Rakowski"],"suffixes":[]},{"firstnames":["Yusheng"],"propositions":[],"lastnames":["Bian"],"suffixes":[]},{"firstnames":["Peter"],"propositions":[],"lastnames":["Debackere"],"suffixes":[]},{"firstnames":["Matthias"],"propositions":[],"lastnames":["Kuntz"],"suffixes":[]}],"keywords":"Photonic-integrated circuit, high-volume manufacturing, monolithic photonic-integrated circuit, heterogeneous photonic-integrated circuit, hybrid photonic-integrated circuit, fully photonic-integrated circuit, InP III–V photonic-integrated circuit, photonics in-line and end-of-line testing","abstract":"Photonic-integrated circuits (PICs) integrate photonics elements, such as light sources, passive and active components, along with electronics elements, such as drivers, amplifiers, and application-specific integrated circuits, on a homogeneous or a heterogeneous material platform for various applications, such as data centers, communications, LIDAR, sensors, and spectroscopy. These components are fabricated separately or assembled monolithically on the silicon line to form the PIC. This chapter discusses the various chip fabrication and testing schemes leading to high-volume manufacturing of the PIC, such as (1) hybrid, (2) heterogeneous, (3) monolithic, (4) fully monolithic on silicon, and (5) indium phosphide III–V material platforms.","bibtex":"@incollection{JACOB2023369,\ntitle = {Photonic-integrated circuit fabrication and test approaches},\neditor = {Madeleine Glick and Ling Liao and Katharine Schmidtke},\nbooktitle = {Integrated Photonics for Data Communication Applications},\npublisher = {Elsevier},\npages = {369-410},\nyear = {2023},\nseries = {Integrated Photonics Apps Specific Design &Manufacturing},\nisbn = {978-0-323-91224-2},\ndoi = {https://doi.org/10.1016/B978-0-323-91224-2.00012-6},\nurl = {https://www.sciencedirect.com/science/article/pii/B9780323912242000126},\nauthor = {Ajey P. Jacob and Sujith Chandran and Joris {Van Campenhout} and Marianna Pantouvaki and John Heck and Ken Giewont and Michal Rakowski and Yusheng Bian and Peter Debackere and Matthias Kuntz},\nkeywords = {Photonic-integrated circuit, high-volume manufacturing, monolithic photonic-integrated circuit, heterogeneous photonic-integrated circuit, hybrid photonic-integrated circuit, fully photonic-integrated circuit, InP III–V photonic-integrated circuit, photonics in-line and end-of-line testing},\nabstract = {Photonic-integrated circuits (PICs) integrate photonics elements, such as light sources, passive and active components, along with electronics elements, such as drivers, amplifiers, and application-specific integrated circuits, on a homogeneous or a heterogeneous material platform for various applications, such as data centers, communications, LIDAR, sensors, and spectroscopy. These components are fabricated separately or assembled monolithically on the silicon line to form the PIC. This chapter discusses the various chip fabrication and testing schemes leading to high-volume manufacturing of the PIC, such as (1) hybrid, (2) heterogeneous, (3) monolithic, (4) fully monolithic on silicon, and (5) indium phosphide III–V material platforms.}\n}\n\n","author_short":["Jacob, A. 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