@inproceedings{ dblp2657297,
  title = {Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices},
  author = {Myeong-Hyeok Jeong and Jae-Won Kim and Byung-Hyun Kwak and Young-Bae Park and Byoung-Joon Kim and Young-Chang Joo},
  author_short = {Jeong, M. and Kim, J. and Kwak, B. and Park, Y. and Kim, B. and Joo, Y.},
  bibtype = {inproceedings},
  type = {inproceedings},
  year = {2011},
  key = {dblp2657297},
  id = {dblp2657297},
  biburl = {http://www.dblp.org/rec/bibtex/conf/biostec/JeongKKPKJ11},
  url = {},
  conference = {BIODEVICES},
  pages = {311-314},
  text = {BIODEVICES 2011:311-314},
  booktitle = {Proceedings of Biomedical Electronics and Devices (BIODEVICES)}
}

{"_id":"hAXpmX79BGfj8QCyK","bibbaseid":"jeong-kim-kwak-park-kim-joo-electricalreliabilityofcusnmicrobumpinwaferlevelpackagingforbiomemsdevices-2011","downloads":0,"creationDate":"2016-02-10T20:02:41.974Z","title":"Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices","author_short":["Jeong, M.","Kim, J.","Kwak, B.","Park, Y.","Kim, B.","Joo, Y."],"year":2011,"bibtype":"inproceedings","biburl":"http://www.dblp.org/rec/bibtex/conf/biostec/JeongKKPKJ11","bibdata":{"title":"Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices","author":["Myeong-Hyeok Jeong","Jae-Won Kim","Byung-Hyun Kwak","Young-Bae Park","Byoung-Joon Kim","Young-Chang Joo"],"author_short":["Jeong, M.","Kim, J.","Kwak, B.","Park, Y.","Kim, B.","Joo, Y."],"bibtype":"inproceedings","type":"inproceedings","year":"2011","key":"dblp2657297","id":"dblp2657297","biburl":"http://www.dblp.org/rec/bibtex/conf/biostec/JeongKKPKJ11","url":"","conference":"BIODEVICES","pages":"311-314","text":"BIODEVICES 2011:311-314","booktitle":"Proceedings of Biomedical Electronics and Devices (BIODEVICES)","bibtex":"@inproceedings{ dblp2657297,\n title = {Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices},\n author = {Myeong-Hyeok Jeong and Jae-Won Kim and Byung-Hyun Kwak and Young-Bae Park and Byoung-Joon Kim and Young-Chang Joo},\n author_short = {Jeong, M. and Kim, J. and Kwak, B. and Park, Y. and Kim, B. and Joo, Y.},\n bibtype = {inproceedings},\n type = {inproceedings},\n year = {2011},\n key = {dblp2657297},\n id = {dblp2657297},\n biburl = {http://www.dblp.org/rec/bibtex/conf/biostec/JeongKKPKJ11},\n url = {},\n conference = {BIODEVICES},\n pages = {311-314},\n text = {BIODEVICES 2011:311-314},\n booktitle = {Proceedings of Biomedical Electronics and Devices (BIODEVICES)}\n}","bibbaseid":"jeong-kim-kwak-park-kim-joo-electricalreliabilityofcusnmicrobumpinwaferlevelpackagingforbiomemsdevices-2011","role":"author","urls":{},"downloads":0},"search_terms":["electrical","reliability","micro","bump","wafer","level","packaging","biomems","devices","jeong","kim","kwak","park","kim","joo"],"keywords":[],"authorIDs":[],"dataSources":["yBsSGfnWcGBeLzmct"]}