Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI. Ji, Y., Kim, J., Kim, J., Lee, M., Noh, J., Jeong, T., Shin, J., Kim, J., Heo, Y., Cho, U., Sagong, H., Park, J., Choo, Y., Do, G., Kang, H., Choi, E., Sun, D., Kang, C., Shin, S., & Pae, S. In IRPS, pages 3, 2018. IEEE.
Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI. [link]Link  Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI. [link]Paper  bibtex   
@inproceedings{conf/irps/JiKKLNJSKHCSPCD18,
  added-at = {2019-01-22T00:00:00.000+0100},
  author = {Ji, Younggeun and Kim, Jeonghoon and Kim, Jungin and Lee, Miji and Noh, Jaeheon and Jeong, Taeyoung and Shin, Juhyeon and Kim, Junho and Heo, Young and Cho, Ung and Sagong, Hyun-Chul and Park, Junekyun and Choo, Yeonsik and Do, Gilhwan and Kang, Hoyoung and Choi, Eunkyeong and Sun, Dongyoon and Kang, Changki and Shin, Sangchul and Pae, Sangwoo},
  biburl = {https://www.bibsonomy.org/bibtex/2e3ef79d4f664145651259bddc20cf826/dblp},
  booktitle = {IRPS},
  crossref = {conf/irps/2018},
  ee = {https://doi.org/10.1109/IRPS.2018.8353570},
  interhash = {be1ce387892ea8fab0726f9ebd4c9bbf},
  intrahash = {e3ef79d4f664145651259bddc20cf826},
  isbn = {978-1-5386-5479-8},
  keywords = {dblp},
  pages = 3,
  publisher = {IEEE},
  timestamp = {2019-01-23T11:37:34.000+0100},
  title = {Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI.},
  url = {http://dblp.uni-trier.de/db/conf/irps/irps2018.html#JiKKLNJSKHCSPCD18},
  year = 2018
}

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