An Electrothermally-Actuated Bistable MEMS Relay for Power Applications. Jin, Q. Massachusetts Institute of Technology, 2003. abstract bibtex This thesis first develops a bistable mechanism that does not rely on internal stress or hinges for its bistability, which is then combined with transient electrothermal actuation and contact structure to develop a MEMS relay for power switching. The relay components, fabricated by a through etch of a silicon wafer using deep reactive ion etch (DRIE), move laterally in the plane of the wafer. The synthesis, analysis, design, fabrication and testing of the relay are all described in this thesis.
@article{jin_electrothermally-actuated_2003,
title = {An {Electrothermally}-{Actuated} {Bistable} {MEMS} {Relay} for {Power} {Applications}},
abstract = {This thesis first develops a bistable mechanism that does not rely on internal stress or hinges for its bistability, which is then combined with transient electrothermal actuation and contact structure to develop a MEMS relay for power switching. The relay components, fabricated by a through etch of a silicon wafer using deep reactive ion etch (DRIE), move laterally in the plane of the wafer. The synthesis, analysis, design, fabrication and testing of the relay are all described in this thesis.},
journal = {Massachusetts Institute of Technology},
author = {Jin, Qiu},
year = {2003},
pages = {94},
}
Downloads: 0
{"_id":"hRQqtjCbBEn2CNYvo","bibbaseid":"jin-anelectrothermallyactuatedbistablememsrelayforpowerapplications-2003","author_short":["Jin, Q."],"bibdata":{"bibtype":"article","type":"article","title":"An Electrothermally-Actuated Bistable MEMS Relay for Power Applications","abstract":"This thesis first develops a bistable mechanism that does not rely on internal stress or hinges for its bistability, which is then combined with transient electrothermal actuation and contact structure to develop a MEMS relay for power switching. The relay components, fabricated by a through etch of a silicon wafer using deep reactive ion etch (DRIE), move laterally in the plane of the wafer. The synthesis, analysis, design, fabrication and testing of the relay are all described in this thesis.","journal":"Massachusetts Institute of Technology","author":[{"propositions":[],"lastnames":["Jin"],"firstnames":["Qiu"],"suffixes":[]}],"year":"2003","pages":"94","bibtex":"@article{jin_electrothermally-actuated_2003,\n\ttitle = {An {Electrothermally}-{Actuated} {Bistable} {MEMS} {Relay} for {Power} {Applications}},\n\tabstract = {This thesis first develops a bistable mechanism that does not rely on internal stress or hinges for its bistability, which is then combined with transient electrothermal actuation and contact structure to develop a MEMS relay for power switching. The relay components, fabricated by a through etch of a silicon wafer using deep reactive ion etch (DRIE), move laterally in the plane of the wafer. The synthesis, analysis, design, fabrication and testing of the relay are all described in this thesis.},\n\tjournal = {Massachusetts Institute of Technology},\n\tauthor = {Jin, Qiu},\n\tyear = {2003},\n\tpages = {94},\n}\n\n","author_short":["Jin, Q."],"key":"jin_electrothermally-actuated_2003","id":"jin_electrothermally-actuated_2003","bibbaseid":"jin-anelectrothermallyactuatedbistablememsrelayforpowerapplications-2003","role":"author","urls":{},"metadata":{"authorlinks":{}},"html":""},"bibtype":"article","biburl":"https://bibbase.org/zotero/davidrpoa","dataSources":["fvS7tt2THEKMbWDXR"],"keywords":[],"search_terms":["electrothermally","actuated","bistable","mems","relay","power","applications","jin"],"title":"An Electrothermally-Actuated Bistable MEMS Relay for Power Applications","year":2003}