Shear properties of In-Bi alloy joints with Cu substrates during thermal aging. Jin, S., Kim, M., Kanayama, S., & Nishikawa, H. Microelectronics Reliability, 88-90:795-800, 2018.
Shear properties of In-Bi alloy joints with Cu substrates during thermal aging. [link]Link  Shear properties of In-Bi alloy joints with Cu substrates during thermal aging. [link]Paper  bibtex   
@article{journals/mr/JinKKN18,
  added-at = {2019-01-07T00:00:00.000+0100},
  author = {Jin, Sanghun and Kim, Min-Su and Kanayama, Shutetsu and Nishikawa, Hiroshi},
  biburl = {https://www.bibsonomy.org/bibtex/2865f20f1914babdc7f88b1d8746bc246/dblp},
  ee = {https://doi.org/10.1016/j.microrel.2018.07.046},
  interhash = {4f601651a0834a96a72142f4ca86679f},
  intrahash = {865f20f1914babdc7f88b1d8746bc246},
  journal = {Microelectronics Reliability},
  keywords = {dblp},
  pages = {795-800},
  timestamp = {2019-01-08T11:37:57.000+0100},
  title = {Shear properties of In-Bi alloy joints with Cu substrates during thermal aging.},
  url = {http://dblp.uni-trier.de/db/journals/mr/mr88.html#JinKKN18},
  volume = {88-90},
  year = 2018
}

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