Shear properties of In-Bi alloy joints with Cu substrates during thermal aging. Jin, S., Kim, M., Kanayama, S., & Nishikawa, H. Microelectronics Reliability, 88-90:795-800, 2018. Link Paper bibtex @article{journals/mr/JinKKN18,
added-at = {2019-01-07T00:00:00.000+0100},
author = {Jin, Sanghun and Kim, Min-Su and Kanayama, Shutetsu and Nishikawa, Hiroshi},
biburl = {https://www.bibsonomy.org/bibtex/2865f20f1914babdc7f88b1d8746bc246/dblp},
ee = {https://doi.org/10.1016/j.microrel.2018.07.046},
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journal = {Microelectronics Reliability},
keywords = {dblp},
pages = {795-800},
timestamp = {2019-01-08T11:37:57.000+0100},
title = {Shear properties of In-Bi alloy joints with Cu substrates during thermal aging.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr88.html#JinKKN18},
volume = {88-90},
year = 2018
}
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