Heat Generation in Bond Wires. Jung, C. C., Silber, C., & Scheible, J. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 5(10):1465–1476, Institute of Electrical and Electronics Engineers (IEEE), October, 2015.
doi  bibtex   
@Article{         Jung_2015aa,
  author        = {Jung, Carl Christoph and Silber, Christian and Scheible, Jürgen},
  citable       = {1},
  doi           = {10.1109/tcpmt.2015.2429743},
  file          = {Jung_2015aa.pdf},
  group         = {casper},
  internal      = {0},
  journal       = {IEEE Transactions on Components, Packaging, and Manufacturing Technology},
  keywords      = {electrothermal,electronics,bondwires},
  langid        = {english},
  month         = oct,
  number        = {10},
  pages         = {1465--1476},
  publisher     = {Institute of Electrical {and} Electronics Engineers ({IEEE})},
  title         = {Heat Generation in Bond Wires},
  volume        = {5},
  year          = {2015},
  shortjournal  = {IEEE Trans. Compon. Packag. Manuf.}
}

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