Heat Generation in Bond Wires. Jung, C. C., Silber, C., & Scheible, J. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 5(10):1465–1476, Institute of Electrical and Electronics Engineers (IEEE), October, 2015. doi bibtex @Article{ Jung_2015aa,
author = {Jung, Carl Christoph and Silber, Christian and Scheible, Jürgen},
citable = {1},
doi = {10.1109/tcpmt.2015.2429743},
file = {Jung_2015aa.pdf},
group = {casper},
internal = {0},
journal = {IEEE Transactions on Components, Packaging, and Manufacturing Technology},
keywords = {electrothermal,electronics,bondwires},
langid = {english},
month = oct,
number = {10},
pages = {1465--1476},
publisher = {Institute of Electrical {and} Electronics Engineers ({IEEE})},
title = {Heat Generation in Bond Wires},
volume = {5},
year = {2015},
shortjournal = {IEEE Trans. Compon. Packag. Manuf.}
}
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