@article{kang_interfacial_1996,
	title = {Interfacial reactions during soldering with lead-tin eutectic and lead ({Pb})-free, tin-rich solders},
	volume = {25},
	issn = {0361-5235, 1543-186X},
	url = {http://link.springer.com/10.1007/BF02659912},
	doi = {10.1007/BF02659912},
	language = {en},
	number = {7},
	urldate = {2021-05-07},
	journal = {Journal of Electronic Materials},
	author = {Kang, S. K. and Rai, R. S. and Purushothaman, S.},
	month = jul,
	year = {1996},
	pages = {1113--1120},
}

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