Innovative engineering outreach using Intel\(^\mbox®\) security and embedded tools. Kannavara, R., Schaumont, P., Maniatakos, M., Smith, M. A., & Buck, S. In 10th European Workshop on Microelectronics Education (EWME), Tallinn, Estonia, May 14-16, 2014, pages 127–132, 2014. IEEE.
Innovative engineering outreach using Intel\(^\mbox®\) security and embedded tools [link]Paper  doi  bibtex   
@inproceedings{DBLP:conf/ewme/KannavaraSMSB14,
  author       = {Raghudeep Kannavara and
                  Patrick Schaumont and
                  Michail Maniatakos and
                  Michael A. Smith and
                  Scott Buck},
  title        = {Innovative engineering outreach using Intel\({}^{\mbox{{\textregistered}}}\)
                  security and embedded tools},
  booktitle    = {10th European Workshop on Microelectronics Education (EWME), Tallinn,
                  Estonia, May 14-16, 2014},
  pages        = {127--132},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/EWME.2014.6877411},
  doi          = {10.1109/EWME.2014.6877411},
  timestamp    = {Mon, 15 Jun 2020 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/ewme/KannavaraSMSB14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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