Innovative engineering outreach using Intel\(\textasciicircum\mbox®\) security and embedded tools. Kannavara, R., Schaumont, P., Maniatakos, M., Smith, M. A., & Buck, S. In 10th European Workshop on Microelectronics Education (EWME), Tallinn, Estonia, May 14-16, 2014, pages 127–132, 2014. IEEE. ![Innovative engineering outreach using Intel\(\textasciicircum\mbox®\) security and embedded tools [link]](https://bibbase.org/img/filetypes/link.svg "link")
Paper doi bibtex @inproceedings{kannavara_innovative_2014,
title = {Innovative engineering outreach using {Intel}{\textbackslash}({\textasciicircum}{\textbackslash}mbox®{\textbackslash}) security and embedded tools},
url = {https://doi.org/10.1109/EWME.2014.6877411},
doi = {10.1109/EWME.2014.6877411},
booktitle = {10th {European} {Workshop} on {Microelectronics} {Education} ({EWME}), {Tallinn}, {Estonia}, {May} 14-16, 2014},
publisher = {IEEE},
author = {Kannavara, Raghudeep and Schaumont, Patrick and Maniatakos, Michail and Smith, Michael A. and Buck, Scott},
year = {2014},
pages = {127--132},
}
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