Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. Kim, K. S., Huh, S. H., & Suganuma, K. Microelectron. Reliab., 43(2):259-267, 2003. Link Paper bibtex @article{journals/mr/KimHS03,
added-at = {2020-02-22T00:00:00.000+0100},
author = {Kim, K. S. and Huh, S. H. and Suganuma, K.},
biburl = {https://www.bibsonomy.org/bibtex/236ac5d32902fa8a499e7216ca83266d0/dblp},
ee = {https://doi.org/10.1016/S0026-2714(02)00239-1},
interhash = {062713448ee20ba87808771e81ecdf74},
intrahash = {36ac5d32902fa8a499e7216ca83266d0},
journal = {Microelectron. Reliab.},
keywords = {dblp},
number = 2,
pages = {259-267},
timestamp = {2020-02-25T13:28:18.000+0100},
title = {Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr43.html#KimHS03},
volume = 43,
year = 2003
}
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