@article{journals/mr/KimHS03,
  added-at = {2020-02-22T00:00:00.000+0100},
  author = {Kim, K. S. and Huh, S. H. and Suganuma, K.},
  biburl = {https://www.bibsonomy.org/bibtex/236ac5d32902fa8a499e7216ca83266d0/dblp},
  ee = {https://doi.org/10.1016/S0026-2714(02)00239-1},
  interhash = {062713448ee20ba87808771e81ecdf74},
  intrahash = {36ac5d32902fa8a499e7216ca83266d0},
  journal = {Microelectron. Reliab.},
  keywords = {dblp},
  number = 2,
  pages = {259-267},
  timestamp = {2020-02-25T13:28:18.000+0100},
  title = {Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu.},
  url = {http://dblp.uni-trier.de/db/journals/mr/mr43.html#KimHS03},
  volume = 43,
  year = 2003
}

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