Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening. Kim, H. K. & Tu, K. N. Physical Review B, 53(23):16027–16034, June, 1996. ![Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening [link]](https://bibbase.org/img/filetypes/link.svg "link")
Paper doi bibtex @article{kim_kinetic_1996,
title = {Kinetic analysis of the soldering reaction between eutectic {SnPb} alloy and {Cu} accompanied by ripening},
volume = {53},
issn = {0163-1829, 1095-3795},
url = {https://link.aps.org/doi/10.1103/PhysRevB.53.16027},
doi = {10.1103/PhysRevB.53.16027},
language = {en},
number = {23},
urldate = {2021-05-07},
journal = {Physical Review B},
author = {Kim, H. K. and Tu, K. N.},
month = jun,
year = {1996},
pages = {16027--16034},
}
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