Surface and thickness profile measurement of a transparent film by three-wavelength vertical scanning interferometry. Kitagawa, K. Optics Letters, 39(14):4172–4175, July, 2014. Publisher: Optica Publishing Group
Paper doi abstract bibtex We have developed a novel areal film thickness and topography measurement method using three-wavelength interferometry. The method simultaneously estimates the profiles of the front and back surfaces and the thickness distribution of a transparent film by model-based separation of two overlapped signals in an interferogram. The validity of the proposed method is demonstrated using computer simulations and actual experiments.
@article{kitagawa_surface_2014,
title = {Surface and thickness profile measurement of a transparent film by three-wavelength vertical scanning interferometry},
volume = {39},
copyright = {© 2014 Optical Society of America},
issn = {1539-4794},
url = {https://opg.optica.org/ol/abstract.cfm?uri=ol-39-14-4172},
doi = {10.1364/OL.39.004172},
abstract = {We have developed a novel areal film thickness and topography measurement method using three-wavelength interferometry. The method simultaneously estimates the profiles of the front and back surfaces and the thickness distribution of a transparent film by model-based separation of two overlapped signals in an interferogram. The validity of the proposed method is demonstrated using computer simulations and actual experiments.},
language = {EN},
number = {14},
urldate = {2022-10-14},
journal = {Optics Letters},
author = {Kitagawa, Katsuichi},
month = jul,
year = {2014},
note = {Publisher: Optica Publishing Group},
keywords = {Computer simulation, Extinction coefficients, Fourier transforms, Interferometric imaging, Spectral discrimination, White light interferometry},
pages = {4172--4175},
}
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