Peritectic solidification of Cu–Sn alloys: Microstructural competition at low speed. Kohler, F, Germond, L, Wagnière, J D, & Rappaz, M Acta Materialia, 57(1):56–68, January, 2009.
bibtex   
@article{kohler_peritectic_2009,
	title = {Peritectic solidification of {Cu}–{Sn} alloys: {Microstructural} competition at low speed},
	volume = {57},
	number = {1},
	journal = {Acta Materialia},
	author = {Kohler, F and Germond, L and Wagnière, J D and Rappaz, M},
	month = jan,
	year = {2009},
	pages = {56--68},
}

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